{"product_id":"mimx9352dvvxmab","title":"MIMX9352DVVXMAB","description":"\u003ch2\u003eMIMX9352DVVXMAB - NXP System-on-Chip (SoC)\u003c\/h2\u003e\u003cp\u003eThe \u003cstrong\u003eMIMX9352DVVXMAB\u003c\/strong\u003e from NXP USA Inc. is a high-reliability system-on-chip solution designed for demanding applications across aerospace, automotive, industrial, medical, and telecommunications sectors. This component features a compact 306-LFBGA (11x11) package and is supplied in tray packaging for production-scale integration.\u003c\/p\u003e\u003ch3\u003eKey Features \u0026amp; Benefits\u003c\/h3\u003e\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eAuthorized Distribution:\u003c\/strong\u003e Genuine NXP components with full traceability and compliance documentation\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eRoHS Compliant:\u003c\/strong\u003e Meets environmental standards for global deployment\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eActive Status:\u003c\/strong\u003e Current production part with long lifecycle availability\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eCompact Package:\u003c\/strong\u003e 306-LFBGA (11x11mm) for space-constrained designs\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eProduction Ready:\u003c\/strong\u003e Tray packaging optimized for automated assembly processes\u003c\/li\u003e\n\u003c\/ul\u003e\u003ch3\u003eApplications\u003c\/h3\u003e\u003cp\u003eIdeal for embedded systems requiring reliable processing capabilities in industrial automation, automotive electronics, medical devices, and telecommunications infrastructure. Suitable for design-in projects requiring long-term component availability and comprehensive technical support.\u003c\/p\u003e\u003ch3\u003eTechnical Support\u003c\/h3\u003e\u003cp\u003eComplete datasheets, reference designs, and application notes available. Our engineering team provides design-in support to help accelerate your product development cycle.\u003c\/p\u003e\u003ch3\u003eComplete Product Specifications\u003c\/h3\u003e\u003ctable\u003e\n\u003ccolgroup\u003e\u003ccol\u003e\u003c\/colgroup\u003e \u003ctbody\u003e \u003ctr\u003e \t\u003ctd\u003eProduct attributes\u003c\/td\u003e \t\u003ctd\u003eProperty Value\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eManufacturer\u003c\/td\u003e \t\u003ctd\u003eNXP USA Inc.\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eProduct Series\u003c\/td\u003e \t\u003ctd\u003e\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003ePackaging\u003c\/td\u003e \t\u003ctd\u003eTray | \u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003ePart Status\u003c\/td\u003e \t\u003ctd\u003eActive\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eArchitecture\u003c\/td\u003e \t\u003ctd\u003e-\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eCore Processor\u003c\/td\u003e \t\u003ctd\u003e-\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eFlash Size\u003c\/td\u003e \t\u003ctd\u003e-\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eRAM Size\u003c\/td\u003e \t\u003ctd\u003e-\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003ePeripherals\u003c\/td\u003e \t\u003ctd\u003e-\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eConnectivity\u003c\/td\u003e \t\u003ctd\u003e-\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eSpeed\u003c\/td\u003e \t\u003ctd\u003e-\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003ePrimary Attributes\u003c\/td\u003e \t\u003ctd\u003e-\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eOperating Temperature\u003c\/td\u003e \t\u003ctd\u003e-\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eGrade\u003c\/td\u003e \t\u003ctd\u003e-\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eQualification\u003c\/td\u003e \t\u003ctd\u003e-\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003ePackage \/ Case\u003c\/td\u003e \t\u003ctd\u003e306-LFBGA\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eSupplier Device Package\u003c\/td\u003e \t\u003ctd\u003e306-LFBGA (11x11)\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e   \u003ctd\u003eROHS\u003c\/td\u003e   \u003ctd\u003e\u003cimg class=\"ROSHICON\" src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0910\/9756\/3425\/files\/ROHSICON.png?v=1757832376\"\u003e\u003c\/td\u003e  \u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e","brand":"NXP USA Inc.","offers":[{"title":"Default Title","offer_id":50860542820641,"sku":"MIMX9352DVVXMAB","price":75.81,"currency_code":"AED","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0910\/9756\/3425\/files\/IC_SOC_MFG_MIMX93xxxVxXMAB_6be42c2c-eb60-41de-9828-091229e54b36.jpg?v=1738606485","url":"https:\/\/hqickey.com\/de\/products\/mimx9352dvvxmab","provider":"HQICKEY","version":"1.0","type":"link"}