{"product_id":"w66bq2nqqafj-tr","title":"W66BQ2NQQAFJ TR","description":"\u003ch2\u003eWinbond W66BQ2NQQAFJ TR - High-Performance LPDDR4X Mobile DRAM\u003c\/h2\u003e\u003cp\u003eThe \u003cstrong\u003eWinbond W66BQ2NQQAFJ TR\u003c\/strong\u003e is a 2Gbit low-power DDR4X (LPDDR4X) mobile DRAM designed for high-performance mobile and embedded applications. Featuring a 1.6 GHz clock frequency and 64M x 32 memory organization, this component delivers exceptional speed and efficiency for demanding workloads.\u003c\/p\u003e\u003ch3\u003eKey Features\u003c\/h3\u003e\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eHigh-Speed Performance:\u003c\/strong\u003e 1.6 GHz clock frequency with 3.6 ns access time\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eLow Power Consumption:\u003c\/strong\u003e LPDDR4X technology optimized for mobile and battery-powered devices\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eIndustrial Temperature Range:\u003c\/strong\u003e Operates reliably from -40°C to 105°C (TC)\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eCompact Package:\u003c\/strong\u003e 200-TFBGA (10x14.5mm) surface mount package\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eRoHS Compliant:\u003c\/strong\u003e Meets environmental standards for global distribution\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eProduction-Ready:\u003c\/strong\u003e Tape \u0026amp; reel packaging for automated assembly\u003c\/li\u003e\n\u003c\/ul\u003e\u003ch3\u003eApplications\u003c\/h3\u003e\u003cp\u003eIdeal for automotive infotainment systems, industrial IoT devices, mobile computing platforms, embedded vision systems, and telecommunications equipment requiring high-bandwidth, low-power memory solutions.\u003c\/p\u003e\u003ch3\u003eComplete Technical Specifications\u003c\/h3\u003e\u003ctable\u003e\n\u003ccolgroup\u003e\u003ccol\u003e\u003c\/colgroup\u003e \u003ctbody\u003e \u003ctr\u003e \t\u003ctd\u003eProduct attributes\u003c\/td\u003e \t\u003ctd\u003eProperty Value\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eManufacturer\u003c\/td\u003e \t\u003ctd\u003eWinbond Electronics\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eProduct Series\u003c\/td\u003e \t\u003ctd\u003e\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003ePackaging\u003c\/td\u003e \t\u003ctd\u003eTape \u0026amp; Reel (TR) | \u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eMemory Type\u003c\/td\u003e \t\u003ctd\u003eVolatile\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eMemory Format\u003c\/td\u003e \t\u003ctd\u003eDRAM\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eTechnology\u003c\/td\u003e \t\u003ctd\u003eSDRAM - Mobile LPDDR4X\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eMemory Size\u003c\/td\u003e \t\u003ctd\u003e2Gbit\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eMemory Organization\u003c\/td\u003e \t\u003ctd\u003e64M x 32\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eMemory Interface\u003c\/td\u003e \t\u003ctd\u003eLVSTL_06\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eClock Frequency\u003c\/td\u003e \t\u003ctd\u003e1.6 GHz\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eWrite Cycle Time - Word, Page\u003c\/td\u003e \t\u003ctd\u003e18ns\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eAccess Time\u003c\/td\u003e \t\u003ctd\u003e3.6 ns\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eVoltage - Supply\u003c\/td\u003e \t\u003ctd\u003e1.06V ~ 1.17V, 1.7V ~ 1.95V\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eOperating Temperature\u003c\/td\u003e \t\u003ctd\u003e-40°C ~ 105°C (TC)\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eGrade\u003c\/td\u003e \t\u003ctd\u003e-\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eQualification\u003c\/td\u003e \t\u003ctd\u003e-\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eMounting Type\u003c\/td\u003e \t\u003ctd\u003eSurface Mount\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003ePackage \/ Case\u003c\/td\u003e \t\u003ctd\u003e200-TFBGA\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eSupplier Device Package\u003c\/td\u003e \t\u003ctd\u003e200-TFBGA (10x14.5)\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e   \u003ctd\u003eROHS\u003c\/td\u003e   \u003ctd\u003e\u003cimg class=\"ROSHICON\" src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0910\/9756\/3425\/files\/ROHSICON.png?v=1761919810\"\u003e\u003c\/td\u003e  \u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\u003ch3\u003eQuality \u0026amp; Compliance\u003c\/h3\u003e\u003cp\u003eThis component is backed by Winbond Electronics' reputation for reliability and quality. Full traceability documentation, datasheets, and technical support are available to ensure seamless design-in and production integration.\u003c\/p\u003e\u003ch3\u003eRelated Resources\u003c\/h3\u003e\u003cp\u003eExplore our complete range of \u003ca href=\"https:\/\/hqickey.com\/collections\/memory\" title=\"Memory Components - DRAM, SRAM, Flash \u0026amp; More\"\u003eMemory Components\u003c\/a\u003e for your semiconductor design needs. Visit our \u003ca href=\"https:\/\/hqickey.com\/\" title=\"HQICKEY - Authorized Semiconductor Component Distributor\"\u003ehomepage\u003c\/a\u003e to browse our full catalog of industrial-grade components, or check out our \u003ca href=\"https:\/\/hqickey.com\/blogs\/news\" title=\"HQICKEY News \u0026amp; Technical Resources\"\u003etechnical blog\u003c\/a\u003e for the latest industry insights and application notes.\u003c\/p\u003e","brand":"Winbond Electronics","offers":[{"title":"Default Title","offer_id":51116420038945,"sku":"W66BQ2NQQAFJ TR","price":13.56,"currency_code":"AED","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0910\/9756\/3425\/files\/pna_en_Public_0b1d1be8-863a-445c-ab2c-d05904a98371.jpg?v=1743655616","url":"https:\/\/hqickey.com\/de\/products\/w66bq2nqqafj-tr","provider":"HQICKEY","version":"1.0","type":"link"}