{"product_id":"w66cp2nqqagj","title":"W66CP2NQQAGJ","description":"\u003ch2\u003eWinbond W66CP2NQQAGJ - High-Performance LPDDR4 Mobile DRAM\u003c\/h2\u003e\u003cp\u003eThe \u003cstrong\u003eW66CP2NQQAGJ\u003c\/strong\u003e from Winbond Electronics is a cutting-edge 4Gbit LPDDR4 SDRAM designed for mobile and embedded applications requiring high-speed, low-power memory solutions. With a clock frequency of 1.867 GHz and ultra-fast 3.6 ns access time, this memory chip delivers exceptional performance for smartphones, tablets, automotive systems, and IoT devices.\u003c\/p\u003e\u003ch3\u003eKey Features \u0026amp; Benefits\u003c\/h3\u003e\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eHigh-Speed Performance:\u003c\/strong\u003e 1.867 GHz clock frequency with 3.6 ns access time for rapid data processing\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eLow Power Consumption:\u003c\/strong\u003e LPDDR4 technology optimized for mobile applications with dual voltage supply (1.06V-1.17V, 1.7V-1.95V)\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eLarge Capacity:\u003c\/strong\u003e 4Gbit (128M x 32) memory organization provides ample storage for demanding applications\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eWide Temperature Range:\u003c\/strong\u003e Operates reliably from -40°C to 105°C (TC), ideal for automotive and industrial environments\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eCompact Surface Mount Package:\u003c\/strong\u003e 200-TFBGA (10x14.5mm) for space-constrained designs\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eRoHS Compliant:\u003c\/strong\u003e Environmentally friendly and meets international standards\u003c\/li\u003e\n\u003c\/ul\u003e\u003ch3\u003eApplications\u003c\/h3\u003e\u003cp\u003ePerfect for smartphones, tablets, automotive infotainment systems, industrial IoT devices, wearables, and embedded computing platforms requiring high-performance, low-power memory solutions.\u003c\/p\u003e\u003ch3\u003eComplete Technical Specifications\u003c\/h3\u003e\u003ctable\u003e\n\u003ccolgroup\u003e\u003ccol\u003e\u003c\/colgroup\u003e \u003ctbody\u003e \u003ctr\u003e \t\u003ctd\u003eProduct attributes\u003c\/td\u003e \t\u003ctd\u003eProperty Value\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eManufacturer\u003c\/td\u003e \t\u003ctd\u003eWinbond Electronics\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eProduct Series\u003c\/td\u003e \t\u003ctd\u003e\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003ePackaging\u003c\/td\u003e \t\u003ctd\u003eTray | Tray\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eMemory Type\u003c\/td\u003e \t\u003ctd\u003eVolatile\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eMemory Format\u003c\/td\u003e \t\u003ctd\u003eDRAM\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eTechnology\u003c\/td\u003e \t\u003ctd\u003eSDRAM - Mobile LPDDR4\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eMemory Size\u003c\/td\u003e \t\u003ctd\u003e4Gbit\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eMemory Organization\u003c\/td\u003e \t\u003ctd\u003e128M x 32\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eMemory Interface\u003c\/td\u003e \t\u003ctd\u003eLVSTL_11\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eClock Frequency\u003c\/td\u003e \t\u003ctd\u003e1.867 GHz\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eWrite Cycle Time - Word, Page\u003c\/td\u003e \t\u003ctd\u003e18ns\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eAccess Time\u003c\/td\u003e \t\u003ctd\u003e3.6 ns\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eVoltage - Supply\u003c\/td\u003e \t\u003ctd\u003e1.06V ~ 1.17V, 1.7V ~ 1.95V\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eOperating Temperature\u003c\/td\u003e \t\u003ctd\u003e-40°C ~ 105°C (TC)\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eGrade\u003c\/td\u003e \t\u003ctd\u003e-\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eQualification\u003c\/td\u003e \t\u003ctd\u003e-\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eMounting Type\u003c\/td\u003e \t\u003ctd\u003eSurface Mount\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003ePackage \/ Case\u003c\/td\u003e \t\u003ctd\u003e200-TFBGA\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eSupplier Device Package\u003c\/td\u003e \t\u003ctd\u003e200-TFBGA (10x14.5)\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e   \u003ctd\u003eROHS\u003c\/td\u003e   \u003ctd\u003e\u003cimg class=\"ROSHICON\" src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0910\/9756\/3425\/files\/ROHSICON.png?v=1761919810\"\u003e\u003c\/td\u003e  \u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\u003ch3\u003eWhy Choose Winbond W66CP2NQQAGJ?\u003c\/h3\u003e\u003cp\u003eWinbond Electronics is a trusted leader in semiconductor memory solutions with decades of experience. The W66CP2NQQAGJ combines proven reliability, cutting-edge LPDDR4 technology, and comprehensive quality assurance to deliver consistent performance in mission-critical applications. Backed by full technical documentation and global support, this memory chip is the ideal choice for engineers and designers seeking high-quality, long-lifecycle components.\u003c\/p\u003e","brand":"Winbond Electronics","offers":[{"title":"Default Title","offer_id":51116604653857,"sku":"W66CP2NQQAGJ","price":16.6,"currency_code":"AED","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0910\/9756\/3425\/files\/pna_en_Public_d3366636-142c-4f54-8027-b2137560e865.jpg?v=1743659753","url":"https:\/\/hqickey.com\/de\/products\/w66cp2nqqagj","provider":"HQICKEY","version":"1.0","type":"link"}