{"product_id":"w959d8nfya5i-tr","title":"W959D8NFYA5I TR","description":"\u003ch2\u003eWinbond W959D8NFYA5I TR - High-Performance 512Mbit HyperRAM Memory Solution\u003c\/h2\u003e\u003cp\u003eThe Winbond W959D8NFYA5I TR is a cutting-edge 512Mbit HyperRAM DRAM memory integrated circuit engineered for mission-critical applications in aerospace, automotive, industrial control systems, medical devices, and telecommunications infrastructure. This high-reliability memory solution delivers exceptional performance with a 200MHz clock frequency and ultra-fast 35ns access time, making it ideal for embedded systems requiring rapid data processing and reliable operation across extreme temperature ranges.\u003c\/p\u003e\u003cp\u003eBuilt on advanced HyperBus interface technology, this volatile DRAM memory features a 64M x 8 organization optimized for efficient data management. The compact 24-TFBGA surface mount package (6x8mm DDP) enables space-efficient PCB designs while maintaining robust performance characteristics. Operating reliably from -40°C to 85°C, this industrial-grade component meets the demanding requirements of harsh environmental conditions.\u003c\/p\u003e\u003ch3\u003eTechnical Specifications\u003c\/h3\u003e\u003ctable\u003e\n\u003ccolgroup\u003e\u003ccol\u003e\u003c\/colgroup\u003e \u003ctbody\u003e \u003ctr\u003e \t\u003ctd\u003eProduct attributes\u003c\/td\u003e \t\u003ctd\u003eProperty Value\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eManufacturer\u003c\/td\u003e \t\u003ctd\u003eWinbond Electronics\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eProduct Series\u003c\/td\u003e \t\u003ctd\u003e\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003ePackaging\u003c\/td\u003e \t\u003ctd\u003eTape \u0026amp; Reel (TR) | \u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eMemory Type\u003c\/td\u003e \t\u003ctd\u003eVolatile\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eMemory Format\u003c\/td\u003e \t\u003ctd\u003eDRAM\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eTechnology\u003c\/td\u003e \t\u003ctd\u003eHyperRAM\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eMemory Size\u003c\/td\u003e \t\u003ctd\u003e512Mbit\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eMemory Organization\u003c\/td\u003e \t\u003ctd\u003e64M x 8\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eMemory Interface\u003c\/td\u003e \t\u003ctd\u003eHyperBus\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eClock Frequency\u003c\/td\u003e \t\u003ctd\u003e200 MHz\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eWrite Cycle Time - Word, Page\u003c\/td\u003e \t\u003ctd\u003e35ns\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eAccess Time\u003c\/td\u003e \t\u003ctd\u003e35 ns\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eVoltage - Supply\u003c\/td\u003e \t\u003ctd\u003e1.7V ~ 2V\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eOperating Temperature\u003c\/td\u003e \t\u003ctd\u003e-40°C ~ 85°C (TC)\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eGrade\u003c\/td\u003e \t\u003ctd\u003e-\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eQualification\u003c\/td\u003e \t\u003ctd\u003e-\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eMounting Type\u003c\/td\u003e \t\u003ctd\u003eSurface Mount\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003ePackage \/ Case\u003c\/td\u003e \t\u003ctd\u003e24-TBGA\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eSupplier Device Package\u003c\/td\u003e \t\u003ctd\u003e24-TFBGA, DDP (6x8)\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e   \u003ctd\u003eROHS\u003c\/td\u003e   \u003ctd\u003e\u003cimg class=\"ROSHICON\" src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0910\/9756\/3425\/files\/ROHSICON.png?v=1761919810\"\u003e\u003c\/td\u003e  \u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\u003ch3\u003eKey Features \u0026amp; Performance Benefits\u003c\/h3\u003e\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eUltra-Fast Performance:\u003c\/strong\u003e 200MHz clock frequency with 35ns access time ensures rapid data throughput for time-sensitive applications\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eHyperBus Interface:\u003c\/strong\u003e Advanced serial memory interface reduces pin count while maintaining high bandwidth and system efficiency\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eIndustrial Temperature Range:\u003c\/strong\u003e Operates reliably from -40°C to 85°C, perfect for automotive, aerospace, and industrial environments\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eCompact Footprint:\u003c\/strong\u003e 24-TFBGA package (6x8mm) maximizes board space utilization in space-constrained designs\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eLow Voltage Operation:\u003c\/strong\u003e 1.7V to 2V supply voltage range optimizes power consumption for battery-powered and energy-efficient systems\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eHigh Capacity:\u003c\/strong\u003e 512Mbit (64MB) memory density provides ample storage for complex embedded applications\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eRoHS Compliant:\u003c\/strong\u003e Environmentally friendly design meets international regulatory standards\u003c\/li\u003e\n\u003c\/ul\u003e\u003ch3\u003eIdeal Applications\u003c\/h3\u003e\u003cp\u003eThis HyperRAM memory IC is specifically designed for high-reliability applications including automotive infotainment systems, ADAS (Advanced Driver Assistance Systems), industrial automation controllers, medical imaging equipment, aerospace avionics, telecommunications base stations, IoT edge computing devices, and mission-critical embedded systems requiring fast, reliable volatile memory with extended temperature operation.\u003c\/p\u003e\u003ch3\u003eQuality \u0026amp; Reliability\u003c\/h3\u003e\u003cp\u003eManufactured by Winbond Electronics, a global leader in semiconductor memory solutions, the W959D8NFYA5I TR undergoes rigorous quality control and testing procedures to ensure consistent performance and long-term reliability. The tape and reel packaging facilitates automated assembly processes for high-volume manufacturing environments.\u003c\/p\u003e\u003chr\u003e\u003cp\u003e\u003cstrong\u003eRelated Resources:\u003c\/strong\u003e\u003c\/p\u003e\u003cp\u003e\u003ca href=\"https:\/\/hqickey.com\/collections\/memory\" title=\"Memory Solutions - High-Reliability DRAM, Flash \u0026amp; Semiconductor Memory\"\u003eExplore Our Complete Memory Solutions\u003c\/a\u003e | \u003ca href=\"https:\/\/hqickey.com\/\" title=\"HQICKEY - Premium Semiconductor Components for Aerospace, Automotive \u0026amp; Industrial Applications\"\u003eVisit HQICKEY - Your Trusted Semiconductor Partner\u003c\/a\u003e | \u003ca href=\"https:\/\/hqickey.com\/blogs\/news\" title=\"Semiconductor Industry News, Technical Articles \u0026amp; Product Updates\"\u003eRead Latest Industry News \u0026amp; Technical Insights\u003c\/a\u003e\u003c\/p\u003e","brand":"Winbond Electronics","offers":[{"title":"Default Title","offer_id":51116171034913,"sku":"W959D8NFYA5I TR","price":2.76,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0910\/9756\/3425\/files\/IC_Memory_256_24TFBGA-DDP-1._2-6x8_Y_24_48f9926d-c4cc-4b27-8588-a5acbbb37dbf.jpg?v=1743650124","url":"https:\/\/hqickey.com\/de\/products\/w959d8nfya5i-tr","provider":"HQICKEY","version":"1.0","type":"link"}