{"product_id":"xcvc1702-2llensvg1369","title":"XCVC1702-2LLENSVG1369","description":"\u003ch2\u003eAMD Versal™ AI Core XCVC1702-2LLENSVG1369 FPGA System-on-Chip\u003c\/h2\u003e\u003cp\u003eThe \u003cstrong\u003eAMD Versal AI Core XCVC1702-2LLENSVG1369\u003c\/strong\u003e represents the pinnacle of adaptive computing technology, combining high-performance FPGA fabric with embedded processing cores to deliver unmatched flexibility and performance for mission-critical applications across industrial, automotive, aerospace, communications, and edge computing segments.\u003c\/p\u003e\u003ch3\u003eKey Features \u0026amp; Benefits\u003c\/h3\u003e\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003e1 Million Logic Cells\u003c\/strong\u003e – Massive programmable logic capacity for complex designs\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eDual ARM® Cortex®-A72 MPCore™ with CoreSight™\u003c\/strong\u003e – High-performance application processing at 1.08GHz\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eDual ARM® Cortex™-R5F with CoreSight™\u003c\/strong\u003e – Real-time processing at 450MHz for deterministic control\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eAdvanced Connectivity\u003c\/strong\u003e – CANbus, Ethernet, PCIe, USB OTG, I2C, SPI, UART\/USART, MMC\/SD\/SDIO\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eIndustrial-Grade Reliability\u003c\/strong\u003e – 0°C to 100°C junction temperature operating range\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eCompact 1369-FCBGA Package\u003c\/strong\u003e – 35x35mm footprint for space-constrained designs\u003c\/li\u003e\n\u003c\/ul\u003e\u003ch3\u003eIdeal Applications\u003c\/h3\u003e\u003cp\u003eThis Versal AI Core SoC is engineered for demanding applications requiring adaptive intelligence, real-time processing, and high-bandwidth connectivity including autonomous systems, 5G infrastructure, advanced driver assistance systems (ADAS), industrial automation, aerospace \u0026amp; defense, and edge AI inference.\u003c\/p\u003e\u003ch3\u003eTechnical Specifications\u003c\/h3\u003e\u003ctable\u003e\n\u003ccolgroup\u003e\u003ccol\u003e\u003c\/colgroup\u003e \u003ctbody\u003e \u003ctr\u003e \t\u003ctd\u003eProduct attributes\u003c\/td\u003e \t\u003ctd\u003eProperty Value\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eManufacturer\u003c\/td\u003e \t\u003ctd\u003eAMD\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eProduct Series\u003c\/td\u003e \t\u003ctd\u003eVersal™ AI Core\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003ePackaging\u003c\/td\u003e \t\u003ctd\u003eTray | Tray\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eArchitecture\u003c\/td\u003e \t\u003ctd\u003eMPU, FPGA\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eCore Processor\u003c\/td\u003e \t\u003ctd\u003eDual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eFlash Size\u003c\/td\u003e \t\u003ctd\u003e-\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eRAM Size\u003c\/td\u003e \t\u003ctd\u003e-\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003ePeripherals\u003c\/td\u003e \t\u003ctd\u003eDDR, DMA, PCIe\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eConnectivity\u003c\/td\u003e \t\u003ctd\u003eCANbus, EBI\/EMI, Ethernet, I2C, MMC\/SD\/SDIO, SPI, UART\/USART, USB OTG\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eSpeed\u003c\/td\u003e \t\u003ctd\u003e450MHz, 1.08GHz\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003ePrimary Attributes\u003c\/td\u003e \t\u003ctd\u003eVersal™ AI Core FPGA, 1M Logic Cells\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eOperating Temperature\u003c\/td\u003e \t\u003ctd\u003e0°C ~ 100°C (TJ)\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eGrade\u003c\/td\u003e \t\u003ctd\u003e-\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eQualification\u003c\/td\u003e \t\u003ctd\u003e-\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003ePackage \/ Case\u003c\/td\u003e \t\u003ctd\u003e1369-BFBGA, FCBGA\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eSupplier Device Package\u003c\/td\u003e \t\u003ctd\u003e1369-FCBGA (35x35)\u003c\/td\u003e \u003c\/tr\u003e \u003c\/tbody\u003e\n\u003c\/table\u003e\u003cp\u003e\u003cem\u003eAuthentic AMD product with full traceability and documentation. Suitable for industrial-grade applications requiring long product lifecycles and reliable supply chain support.\u003c\/em\u003e\u003c\/p\u003e","brand":"AMD","offers":[{"title":"Default Title","offer_id":50993576182049,"sku":"XCVC1702-2LLENSVG1369","price":107883.72,"currency_code":"AED","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0910\/9756\/3425\/files\/IC_SOC_122_1369BGA-4-35x35_NSVG_1369_688fab57-501e-4bce-a87c-2a5d15ee5366.jpg?v=1741070809","url":"https:\/\/hqickey.com\/de\/products\/xcvc1702-2llensvg1369","provider":"HQICKEY","version":"1.0","type":"link"}