{"product_id":"xcvc1802-1msevsva2197","title":"XCVC1802-1MSEVSVA2197","description":"\u003ch2\u003eAMD XCVC1802-1MSEVSVA2197 Versal™ AI Core FPGA\u003c\/h2\u003e\u003cp\u003eHigh-performance system-on-chip (SoC) FPGA combining adaptive computing with embedded processing for AI, automotive, aerospace, and industrial applications. Features 1.5 million logic cells, dual ARM® Cortex®-A72 and Cortex®-R5F processors, comprehensive connectivity, and industrial-grade reliability.\u003c\/p\u003e\u003ch3\u003eKey Features\u003c\/h3\u003e\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003e1.5M Logic Cells\u003c\/strong\u003e – Versal AI Core architecture for adaptive compute acceleration\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eDual ARM Cortex-A72 MPCore (1.3GHz)\u003c\/strong\u003e – High-performance application processing with CoreSight debug\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eDual ARM Cortex-R5F (600MHz)\u003c\/strong\u003e – Real-time processing for safety-critical workloads\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e256KB On-Chip RAM\u003c\/strong\u003e – Low-latency memory for embedded applications\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eRich Connectivity\u003c\/strong\u003e – PCIe, DDR, Ethernet, USB OTG, CANbus, SPI, I²C, UART, MMC\/SD\/SDIO\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eIndustrial Temperature Range\u003c\/strong\u003e – 0°C to 100°C junction temperature for harsh environments\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e2197-FCBGA Package\u003c\/strong\u003e – 45mm × 45mm fine-pitch ball grid array for high I\/O density\u003c\/li\u003e\n\u003c\/ul\u003e\u003ch3\u003eApplications\u003c\/h3\u003e\u003cp\u003eIdeal for edge AI inference, automotive ADAS\/autonomous driving, 5G wireless infrastructure, aerospace\/defense systems, industrial automation, medical imaging, and high-performance embedded computing requiring heterogeneous processing and FPGA fabric.\u003c\/p\u003e\u003ch3\u003eComplete Technical Specifications\u003c\/h3\u003e\u003ctable\u003e\n\u003ccolgroup\u003e\u003ccol\u003e\u003c\/colgroup\u003e \u003ctbody\u003e \u003ctr\u003e \t\u003ctd\u003eProduct attributes\u003c\/td\u003e \t\u003ctd\u003eProperty Value\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eManufacturer\u003c\/td\u003e \t\u003ctd\u003eAMD\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eProduct Series\u003c\/td\u003e \t\u003ctd\u003eVersal™ AI Core\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003ePackaging\u003c\/td\u003e \t\u003ctd\u003eTray | Tray\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eArchitecture\u003c\/td\u003e \t\u003ctd\u003eMPU, FPGA\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eCore Processor\u003c\/td\u003e \t\u003ctd\u003eDual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eFlash Size\u003c\/td\u003e \t\u003ctd\u003e-\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eRAM Size\u003c\/td\u003e \t\u003ctd\u003e256KB\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003ePeripherals\u003c\/td\u003e \t\u003ctd\u003eDDR, DMA, PCIe\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eConnectivity\u003c\/td\u003e \t\u003ctd\u003eCANbus, EBI\/EMI, Ethernet, I2C, MMC\/SD\/SDIO, SPI, UART\/USART, USB OTG\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eSpeed\u003c\/td\u003e \t\u003ctd\u003e600MHz, 1.3GHz\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003ePrimary Attributes\u003c\/td\u003e \t\u003ctd\u003eVersal™ AI Core FPGA, 1.5M Logic Cells\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eOperating Temperature\u003c\/td\u003e \t\u003ctd\u003e0°C ~ 100°C (TJ)\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eGrade\u003c\/td\u003e \t\u003ctd\u003e-\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eQualification\u003c\/td\u003e \t\u003ctd\u003e-\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003ePackage \/ Case\u003c\/td\u003e \t\u003ctd\u003e2197-BFBGA, FCBGA\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eSupplier Device Package\u003c\/td\u003e \t\u003ctd\u003e2197-FCBGA (45x45)\u003c\/td\u003e \u003c\/tr\u003e \u003c\/tbody\u003e\n\u003c\/table\u003e\u003cp\u003e\u003cstrong\u003eDocumentation:\u003c\/strong\u003e Full datasheets, reference manuals, and design resources available from AMD.\u003c\/p\u003e","brand":"AMD","offers":[{"title":"Default Title","offer_id":50993537450273,"sku":"XCVC1802-1MSEVSVA2197","price":76230.39,"currency_code":"AED","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0910\/9756\/3425\/files\/IC_SOC_122_2197FCBGA-4-45x45_VSVA_2197_9297c4ce-a529-4569-a04e-24df3a644024.jpg?v=1741069898","url":"https:\/\/hqickey.com\/de\/products\/xcvc1802-1msevsva2197","provider":"HQICKEY","version":"1.0","type":"link"}