{"product_id":"xczu57dr-l2ffve1156i","title":"XCZU57DR-L2FFVE1156I","description":"\u003ch2\u003eAMD XCZU57DR-L2FFVE1156I - Zynq UltraScale+ RFSoC DR\u003c\/h2\u003e\u003cp\u003eThe \u003cstrong\u003eXCZU57DR-L2FFVE1156I\u003c\/strong\u003e is a high-performance System-on-Chip (SoC) from AMD's Zynq UltraScale+ RFSoC DR family, combining advanced processing capabilities with FPGA programmability. This industrial-grade device features a Quad ARM Cortex-A53 MPCore with CoreSight and Dual ARM Cortex-R5 with CoreSight, operating at speeds up to 1.3GHz and 533MHz respectively.\u003c\/p\u003e\u003cp\u003eDesigned for demanding applications in aerospace, automotive, communications, and industrial sectors, this RFSoC delivers exceptional performance with comprehensive connectivity options including Ethernet, PCIe, USB OTG, CANbus, and multiple serial interfaces. The 1156-FCBGA package (35x35mm) ensures reliable operation across the extended industrial temperature range of -40°C to 100°C (TJ).\u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eKey Features:\u003c\/strong\u003e\u003c\/p\u003e\u003cul\u003e\n\u003cli\u003eQuad ARM Cortex-A53 MPCore (1.3GHz) + Dual ARM Cortex-R5 (533MHz)\u003c\/li\u003e\n\u003cli\u003eAdvanced FPGA fabric with RF data converter integration\u003c\/li\u003e\n\u003cli\u003eComprehensive peripheral support: DDR, DMA, PCIe, WDT\u003c\/li\u003e\n\u003cli\u003eMulti-protocol connectivity: Ethernet, CANbus, USB OTG, I2C, SPI, UART, MMC\/SD\/SDIO\u003c\/li\u003e\n\u003cli\u003eIndustrial temperature range: -40°C to 100°C\u003c\/li\u003e\n\u003cli\u003e1156-FCBGA package (35x35mm)\u003c\/li\u003e\n\u003cli\u003eActive production status with full documentation\u003c\/li\u003e\n\u003cli\u003eRoHS compliant\u003c\/li\u003e\n\u003c\/ul\u003e\u003ch3\u003eTechnical Specifications\u003c\/h3\u003e\u003ctable\u003e\n\u003ccolgroup\u003e\u003ccol\u003e\u003c\/colgroup\u003e \u003ctbody\u003e \u003ctr\u003e \t\u003ctd\u003eProduct attributes\u003c\/td\u003e \t\u003ctd\u003eProperty Value\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eManufacturer\u003c\/td\u003e \t\u003ctd\u003eAMD\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eProduct Series\u003c\/td\u003e \t\u003ctd\u003eZynq® UltraScale+™ RFSoC DR\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003ePackaging\u003c\/td\u003e \t\u003ctd\u003eTray | \u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003ePart Status\u003c\/td\u003e \t\u003ctd\u003eActive\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eArchitecture\u003c\/td\u003e \t\u003ctd\u003eMPU, FPGA\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eCore Processor\u003c\/td\u003e \t\u003ctd\u003eQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eFlash Size\u003c\/td\u003e \t\u003ctd\u003e-\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eRAM Size\u003c\/td\u003e \t\u003ctd\u003e-\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003ePeripherals\u003c\/td\u003e \t\u003ctd\u003eDDR, DMA, PCIe, WDT\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eConnectivity\u003c\/td\u003e \t\u003ctd\u003eCANbus, EBI\/EMI, Ethernet, I2C, MMC\/SD\/SDIO, SPI, UART\/USART, USB OTG\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eSpeed\u003c\/td\u003e \t\u003ctd\u003e533MHz, 1.3GHz\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003ePrimary Attributes\u003c\/td\u003e \t\u003ctd\u003eZynq® UltraScale+™ RFSoC\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eOperating Temperature\u003c\/td\u003e \t\u003ctd\u003e-40°C ~ 100°C (TJ)\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eGrade\u003c\/td\u003e \t\u003ctd\u003e-\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eQualification\u003c\/td\u003e \t\u003ctd\u003e-\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003ePackage \/ Case\u003c\/td\u003e \t\u003ctd\u003e1156-BBGA, FCBGA\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eSupplier Device Package\u003c\/td\u003e \t\u003ctd\u003e1156-FCBGA (35x35)\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e   \u003ctd\u003eROHS\u003c\/td\u003e   \u003ctd\u003e\u003cimg class=\"ROSHICON\" src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0910\/9756\/3425\/files\/ROHSICON.png?v=1757832376\"\u003e\u003c\/td\u003e  \u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\u003cp\u003e\u003cstrong\u003eApplications:\u003c\/strong\u003e 5G wireless infrastructure, radar and defense systems, test and measurement equipment, software-defined radio, high-speed data acquisition, aerospace and automotive systems.\u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eDocumentation:\u003c\/strong\u003e Full datasheets, reference designs, and technical documentation available from AMD.\u003c\/p\u003e","brand":"AMD","offers":[{"title":"Default Title","offer_id":50862006272289,"sku":"XCZU57DR-L2FFVE1156I","price":90754.02,"currency_code":"AED","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0910\/9756\/3425\/files\/IC_SOC_122_1156FCBGA-3.86-35X35_FFVD_FFVE_1156_53a17809-8dbe-417f-b3dc-db9895338f21.jpg?v=1738658538","url":"https:\/\/hqickey.com\/de\/products\/xczu57dr-l2ffve1156i","provider":"HQICKEY","version":"1.0","type":"link"}