{"product_id":"m2s090-fgg676","title":"M2S090-FGG676","description":"\u003ch2\u003eM2S090-FGG676 SmartFusion2 SoC FPGA Overview\u003c\/h2\u003e\u003cp\u003eThe \u003cstrong\u003eM2S090-FGG676\u003c\/strong\u003e from Microchip Technology is a high-performance SmartFusion®2 System-on-Chip (SoC) FPGA combining an ARM® Cortex®-M3 microcontroller with 90,000 logic modules. Operating at 166MHz with 512KB Flash and 64KB RAM, this device delivers robust processing power for industrial, automotive, aerospace, and communications applications.\u003c\/p\u003e\u003cp\u003eFeaturing advanced connectivity options including CANbus, Ethernet, I²C, SPI, UART\/USART, and USB, plus high-speed peripherals (DDR, PCIe, SERDES), the M2S090-FGG676 provides flexible integration for complex embedded systems. The 676-FBGA (27x27mm) package operates across 0°C to 85°C and is RoHS compliant, ensuring long-term availability and regulatory adherence.\u003c\/p\u003e\u003ch3\u003eKey Features \u0026amp; Benefits\u003c\/h3\u003e\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eDual Architecture:\u003c\/strong\u003e ARM Cortex-M3 MCU + 90K logic FPGA for programmable hardware acceleration\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eHigh-Speed Connectivity:\u003c\/strong\u003e DDR, PCIe, SERDES for data-intensive applications\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eRich Peripheral Set:\u003c\/strong\u003e CANbus, Ethernet, USB, I²C, SPI, UART\/USART\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eGenerous Memory:\u003c\/strong\u003e 512KB Flash, 64KB RAM for firmware and data storage\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eIndustrial Temperature Range:\u003c\/strong\u003e 0°C to 85°C (TJ) for reliable operation\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eCompact BGA Package:\u003c\/strong\u003e 676-FBGA (27x27mm) for space-constrained designs\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eActive \u0026amp; RoHS Compliant:\u003c\/strong\u003e Long-term supply assurance and environmental compliance\u003c\/li\u003e\n\u003c\/ul\u003e\u003ch3\u003eTechnical Specifications\u003c\/h3\u003e\u003ctable\u003e\n\u003ccolgroup\u003e\u003ccol\u003e\u003c\/colgroup\u003e \u003ctbody\u003e \u003ctr\u003e \t\u003ctd\u003eProduct attributes\u003c\/td\u003e \t\u003ctd\u003eProperty Value\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eManufacturer\u003c\/td\u003e \t\u003ctd\u003eMicrochip Technology\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eProduct Series\u003c\/td\u003e \t\u003ctd\u003eSmartFusion®2\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003ePackaging\u003c\/td\u003e \t\u003ctd\u003eTray | \u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003ePart Status\u003c\/td\u003e \t\u003ctd\u003eActive\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eArchitecture\u003c\/td\u003e \t\u003ctd\u003eMCU, FPGA\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eCore Processor\u003c\/td\u003e \t\u003ctd\u003eARM® Cortex®-M3\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eFlash Size\u003c\/td\u003e \t\u003ctd\u003e512KB\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eRAM Size\u003c\/td\u003e \t\u003ctd\u003e64KB\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003ePeripherals\u003c\/td\u003e \t\u003ctd\u003eDDR, PCIe, SERDES\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eConnectivity\u003c\/td\u003e \t\u003ctd\u003eCANbus, Ethernet, I2C, SPI, UART\/USART, USB\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eSpeed\u003c\/td\u003e \t\u003ctd\u003e166MHz\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003ePrimary Attributes\u003c\/td\u003e \t\u003ctd\u003eFPGA - 90K Logic Modules\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eOperating Temperature\u003c\/td\u003e \t\u003ctd\u003e0°C ~ 85°C (TJ)\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eGrade\u003c\/td\u003e \t\u003ctd\u003e-\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eQualification\u003c\/td\u003e \t\u003ctd\u003e-\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003ePackage \/ Case\u003c\/td\u003e \t\u003ctd\u003e676-BGA\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eSupplier Device Package\u003c\/td\u003e \t\u003ctd\u003e676-FBGA (27x27)\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e   \u003ctd\u003eROHS\u003c\/td\u003e   \u003ctd\u003e\u003cimg class=\"ROSHICON\" src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0910\/9756\/3425\/files\/ROHSICON.png?v=1757832376\"\u003e\u003c\/td\u003e  \u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\u003ch3\u003eApplications\u003c\/h3\u003e\u003cul\u003e\n\u003cli\u003eIndustrial automation and control systems\u003c\/li\u003e\n\u003cli\u003eAutomotive electronics and ADAS\u003c\/li\u003e\n\u003cli\u003eAerospace and defense embedded systems\u003c\/li\u003e\n\u003cli\u003eCommunications infrastructure and networking equipment\u003c\/li\u003e\n\u003cli\u003eMedical devices and instrumentation\u003c\/li\u003e\n\u003cli\u003eHigh-reliability embedded computing\u003c\/li\u003e\n\u003c\/ul\u003e\u003cp\u003e\u003cem\u003eAll specifications are subject to manufacturer documentation. Please consult official datasheets for complete design guidelines and electrical characteristics.\u003c\/em\u003e\u003c\/p\u003e","brand":"Microchip Technology","offers":[{"title":"Default Title","offer_id":50861221216545,"sku":"M2S090-FGG676","price":823.03,"currency_code":"AED","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0910\/9756\/3425\/files\/IC_SOC_150_676FBGA-2_44-27X27_FG_FGG_676_d5845adb-f517-446a-bdba-4554fc3719c0.jpg?v=1738618077","url":"https:\/\/hqickey.com\/products\/m2s090-fgg676","provider":"HQICKEY","version":"1.0","type":"link"}