{"product_id":"xcvc1802-1lsivsvd1760","title":"XCVC1802-1LSIVSVD1760","description":"\u003ch2\u003eAMD Versal AI Core XCVC1802-1LSIVSVD1760 FPGA\u003c\/h2\u003e\u003cp\u003eThe AMD Versal AI Core XCVC1802 represents the pinnacle of adaptive computing, combining high-performance FPGA fabric with heterogeneous processing cores. This industrial-grade SoC delivers exceptional flexibility for edge computing, embedded vision, automotive ADAS, aerospace systems, and 5G infrastructure applications.\u003c\/p\u003e\u003ch3\u003eWhy Choose the XCVC1802?\u003c\/h3\u003e\u003cp\u003eEngineers and system architects select the XCVC1802 for mission-critical applications requiring real-time processing, hardware acceleration, and adaptive logic. With dual ARM Cortex-A72 cores running at 1GHz for application processing and dual Cortex-R5F cores at 400MHz for deterministic real-time control, this device handles complex heterogeneous workloads with ease.\u003c\/p\u003e\u003ch3\u003eKey Technical Highlights\u003c\/h3\u003e\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003e1.5M Logic Cells\u003c\/strong\u003e – Extensive programmable logic resources for complex FPGA designs and hardware acceleration\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eDual ARM Cortex-A72 MPCore with CoreSight\u003c\/strong\u003e – High-performance 1GHz application processing with advanced debug capabilities\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eDual ARM Cortex-R5F with CoreSight\u003c\/strong\u003e – Deterministic real-time processing at 400MHz for safety-critical functions\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e256KB On-Chip RAM\u003c\/strong\u003e – Fast local memory for critical operations and low-latency data access\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eAdvanced Connectivity\u003c\/strong\u003e – PCIe Gen4, DDR4\/LPDDR4, Gigabit Ethernet, USB OTG, CANbus, SPI, I²C, UART\/USART\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eIndustrial Temperature Range\u003c\/strong\u003e – Operates reliably from -40°C to 100°C (TJ) for harsh environments\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eCompact 1760-FCBGA Package\u003c\/strong\u003e – Space-efficient 40mm × 40mm form factor for embedded designs\u003c\/li\u003e\n\u003c\/ul\u003e\u003ch3\u003eTarget Applications\u003c\/h3\u003e\u003cp\u003eThe XCVC1802 excels in demanding applications across multiple industries:\u003c\/p\u003e\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eEdge Computing \u0026amp; AI Inference\u003c\/strong\u003e – Hardware-accelerated neural networks and machine learning at the edge\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eEmbedded Vision Systems\u003c\/strong\u003e – Real-time image processing, object detection, and computer vision\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eIndustrial Automation\u003c\/strong\u003e – Programmable logic controllers, motion control, and factory automation\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eAutomotive ADAS\u003c\/strong\u003e – Advanced driver assistance systems with functional safety requirements\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eAerospace \u0026amp; Defense\u003c\/strong\u003e – Avionics, radar processing, and secure communications\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e5G Infrastructure\u003c\/strong\u003e – Baseband processing, beamforming, and network acceleration\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eMedical Imaging\u003c\/strong\u003e – Ultrasound, CT, and real-time diagnostic equipment\u003c\/li\u003e\n\u003c\/ul\u003e\u003ch3\u003eComplete Technical Specifications\u003c\/h3\u003e\u003ctable\u003e\n\u003ccolgroup\u003e\u003ccol\u003e\u003c\/colgroup\u003e \u003ctbody\u003e \u003ctr\u003e \t\u003ctd\u003eProduct attributes\u003c\/td\u003e \t\u003ctd\u003eProperty Value\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eManufacturer\u003c\/td\u003e \t\u003ctd\u003eAMD\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eProduct Series\u003c\/td\u003e \t\u003ctd\u003eVersal™ AI Core\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003ePackaging\u003c\/td\u003e \t\u003ctd\u003eTray | Tray\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eArchitecture\u003c\/td\u003e \t\u003ctd\u003eMPU, FPGA\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eCore Processor\u003c\/td\u003e \t\u003ctd\u003eDual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eFlash Size\u003c\/td\u003e \t\u003ctd\u003e-\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eRAM Size\u003c\/td\u003e \t\u003ctd\u003e256KB\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003ePeripherals\u003c\/td\u003e \t\u003ctd\u003eDDR, DMA, PCIe\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eConnectivity\u003c\/td\u003e \t\u003ctd\u003eCANbus, EBI\/EMI, Ethernet, I2C, MMC\/SD\/SDIO, SPI, UART\/USART, USB OTG\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eSpeed\u003c\/td\u003e \t\u003ctd\u003e400MHz, 1GHz\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003ePrimary Attributes\u003c\/td\u003e \t\u003ctd\u003eVersal™ AI Core FPGA, 1.5M Logic Cells\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eOperating Temperature\u003c\/td\u003e \t\u003ctd\u003e-40°C ~ 100°C (TJ)\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eGrade\u003c\/td\u003e \t\u003ctd\u003e-\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eQualification\u003c\/td\u003e \t\u003ctd\u003e-\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003ePackage \/ Case\u003c\/td\u003e \t\u003ctd\u003e1760-BFBGA, FCBGA\u003c\/td\u003e \u003c\/tr\u003e \u003ctr\u003e \t\u003ctd\u003eSupplier Device Package\u003c\/td\u003e \t\u003ctd\u003e1760-FCBGA (40x40)\u003c\/td\u003e \u003c\/tr\u003e \u003c\/tbody\u003e\n\u003c\/table\u003e\u003ch3\u003eDesign Resources \u0026amp; Support\u003c\/h3\u003e\u003cp\u003e\u003cstrong\u003eDocumentation:\u003c\/strong\u003e Complete datasheets, reference manuals, application notes, and design guides available from AMD Xilinx.\u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eDevelopment Tools:\u003c\/strong\u003e Compatible with AMD Vivado Design Suite and Vitis unified software platform for FPGA and embedded development.\u003c\/p\u003e\u003ch3\u003eQuality \u0026amp; Authenticity\u003c\/h3\u003e\u003cp\u003e\u003cstrong\u003eAuthenticity Guaranteed:\u003c\/strong\u003e Sourced exclusively from authorized AMD distributors with full supply chain traceability.\u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eCompliance:\u003c\/strong\u003e RoHS compliant with complete documentation and certificates of conformance available upon request.\u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eLong-Term Availability:\u003c\/strong\u003e Industrial-grade component with extended product lifecycle support for mission-critical applications.\u003c\/p\u003e","brand":"AMD","offers":[{"title":"Default Title","offer_id":50993551507745,"sku":"XCVC1802-1LSIVSVD1760","price":110108.12,"currency_code":"AED","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0910\/9756\/3425\/files\/IC_SOC_122_1760BGA-4_08-40x40_VSVD_1760_d57b0cda-48cf-447b-86c1-410b0f7dd1b4.jpg?v=1741069995","url":"https:\/\/hqickey.com\/products\/xcvc1802-1lsivsvd1760","provider":"HQICKEY","version":"1.0","type":"link"}