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Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Microsemi Corporation
AFS090-2FGG256
AFS090-2FGG256
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 203.38 AED | Dhs. 203.38 AED |
| 15+ | Dhs. 196.96 AED | Dhs. 2,954.40 AED |
| 25+ | Dhs. 192.68 AED | Dhs. 4,817.00 AED |
| 50+ | Dhs. 181.98 AED | Dhs. 9,099.00 AED |
| 100+ | Dhs. 160.57 AED | Dhs. 16,057.00 AED |
| N+ | Dhs. 32.11 AED | Price Inquiry |
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Microsemi Fusion® AFS090-2FGG256 FPGA – Industrial-Grade Mixed-Signal FPGA
The AFS090-2FGG256 is a high-performance, low-power field-programmable gate array (FPGA) from Microsemi's proven Fusion® family, engineered for mission-critical embedded applications requiring mixed-signal integration, long lifecycle support, and exceptional reliability. With 90,000 system gates, 75 I/O pins, and 27,648 RAM bits in a compact 256-FBGA package, this FPGA delivers robust performance for industrial, aerospace, automotive, telecommunications, and medical device applications.
Why Choose the AFS090-2FGG256?
- 90,000 system gates – Ample logic resources for complex digital designs and signal processing
- 75 I/O pins – Flexible connectivity for interfacing with sensors, controllers, and communication modules
- 27,648 RAM bits – On-chip memory for buffering, data storage, and state machines
- 256-FBGA package (17×17mm) – Space-efficient surface mount design for compact PCB layouts
- Industrial temperature range: 0°C to 85°C (TJ) – Reliable operation in harsh environments
- Low-power supply: 1.425V to 1.575V – Optimized for battery-powered and energy-efficient systems
- RoHS compliant – Meets environmental and regulatory standards for global markets
- Long lifecycle availability – Backed by Microsemi's commitment to extended product support for aerospace, defense, and industrial OEMs
Target Applications
The AFS090-2FGG256 is ideal for applications demanding high reliability, full traceability, and long-term availability:
- Aerospace & Defense: Avionics, radar systems, secure communications, and mission-critical control systems
- Industrial Automation: PLCs, motor control, robotics, and process monitoring
- Medical Devices: Diagnostic equipment, patient monitoring, and imaging systems
- Telecommunications: Base stations, network infrastructure, and protocol converters
- Automotive: ADAS, infotainment, and powertrain control modules
Complete Technical Specifications
| Product attributes | Property Value |
| Manufacturer | Microsemi Corporation |
| Product Series | Fusion® |
| Packaging | Tray | Tray |
| Number of LABs/CLBs | - |
| Number of Logic Elements/Cells | - |
| Total RAM Bits | 27648 |
| Number of I/O | 75 |
| Number of Gates | 90000 |
| Voltage - Supply | 1.425V ~ 1.575V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 256-LBGA |
| Supplier Device Package | 256-FPBGA (17x17) |
Quality & Traceability
Every AFS090-2FGG256 unit is fully traceable to the manufacturer's lot and date code, ensuring compliance with aerospace (AS9100), automotive (IATF 16949), and medical (ISO 13485) quality standards. Full datasheets, application notes, and design-in support are available from Microsemi.
All specifications are sourced from the manufacturer's official datasheet and are subject to change without notice. Please consult the latest datasheet and contact our technical team for design-in reference and lifecycle commitment details.
Datasheets:
AFS090-2FGG256
.pdf
