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AMD
XCVC1702-2LLENSVG1369
XCVC1702-2LLENSVG1369
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 107,884.30 AED | Dhs. 107,884.30 AED |
| 15+ | Dhs. 104,477.41 AED | Dhs. 1,567,161.15 AED |
| 25+ | Dhs. 102,206.16 AED | Dhs. 2,555,154.00 AED |
| 50+ | Dhs. 96,528.04 AED | Dhs. 4,826,402.00 AED |
| 100+ | Dhs. 85,171.80 AED | Dhs. 8,517,180.00 AED |
| N+ | Dhs. 17,034.36 AED | Price Inquiry |
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AMD Versal™ AI Core XCVC1702-2LLENSVG1369 FPGA System-on-Chip
The AMD Versal AI Core XCVC1702-2LLENSVG1369 represents the pinnacle of adaptive computing technology, combining high-performance FPGA fabric with embedded processing cores to deliver unmatched flexibility and performance for mission-critical applications across industrial, automotive, aerospace, communications, and edge computing segments.
Key Features & Benefits
- 1 Million Logic Cells – Massive programmable logic capacity for complex designs
- Dual ARM® Cortex®-A72 MPCore™ with CoreSight™ – High-performance application processing at 1.08GHz
- Dual ARM® Cortex™-R5F with CoreSight™ – Real-time processing at 450MHz for deterministic control
- Advanced Connectivity – CANbus, Ethernet, PCIe, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO
- Industrial-Grade Reliability – 0°C to 100°C junction temperature operating range
- Compact 1369-FCBGA Package – 35x35mm footprint for space-constrained designs
Ideal Applications
This Versal AI Core SoC is engineered for demanding applications requiring adaptive intelligence, real-time processing, and high-bandwidth connectivity including autonomous systems, 5G infrastructure, advanced driver assistance systems (ADAS), industrial automation, aerospace & defense, and edge AI inference.
Technical Specifications
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ AI Core |
| Packaging | Tray | Tray |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | - |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 450MHz, 1.08GHz |
| Primary Attributes | Versal™ AI Core FPGA, 1M Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1369-BFBGA, FCBGA |
| Supplier Device Package | 1369-FCBGA (35x35) |
Authentic AMD product with full traceability and documentation. Suitable for industrial-grade applications requiring long product lifecycles and reliable supply chain support.
Datasheets:
XCVC1702-2LLENSVG1369
.pdf
