Altera 1SX250LU2F50I1VG

Zu Produktinformationen springen
1 von 1
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Normaler Preis Dhs. 93,002.30
Normaler Preis Dhs. 97,897.14 Verkaufspreis Dhs. 93,002.30
Sale Ausverkauft
Quantity Unit Price Total Price
1 Dhs. 93,002.30 Dhs. 93,002.30
15+ Dhs. 90,065.37 Dhs. 1,350,980.55
25+ Dhs. 88,107.43 Dhs. 2,202,685.75
50+ Dhs. 83,212.57 Dhs. 4,160,628.50
100+ Dhs. 73,422.86 Dhs. 7,342,286.00
N+ Dhs. 14,684.57 Price Inquiry
Versand wird beim Checkout berechnet
Anzahl
Component Recycling

Request Quote / Inquiry

Product attributes Property Value
Manufacturer Altera
Product Series Stratix® 10 SX
Packaging Tray | Tray
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 1.5GHz
Primary Attributes FPGA - 2500K Logic Elements
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 2397-BBGA, FCBGA
Supplier Device Package 2397-FBGA, FC (50x50)

Intel Altera Stratix 10 SX FPGA System-on-Chip

The 1SX250LU2F50I1VG is a high-performance FPGA System-on-Chip from Intel's Stratix® 10 SX family, combining the flexibility of FPGA fabric with the processing power of quad ARM® Cortex®-A53 cores. This advanced SoC delivers exceptional performance for demanding industrial, automotive, aerospace, and communications applications.

Key Features & Benefits

  • Powerful Processing: Quad ARM Cortex-A53 MPCore with CoreSight running at 1.5GHz for intensive computational tasks
  • Massive Logic Capacity: 2500K logic elements provide extensive FPGA resources for complex designs
  • Industrial-Grade Reliability: Operating temperature range of -40°C to 100°C (TJ) ensures reliable operation in harsh environments
  • Rich Connectivity: Comprehensive peripheral support including Ethernet, USB OTG, SPI, I2C, UART/USART, MMC/SD/SDIO, and EBI/EMI interfaces
  • Advanced Architecture: Hybrid MCU and FPGA architecture enables flexible hardware acceleration and real-time processing
  • Compact High-Density Package: 2397-FBGA flip-chip ball grid array (50x50mm) for space-constrained designs

Ideal Applications

This SoC is engineered for mission-critical applications requiring both processing power and FPGA flexibility, including edge computing platforms, industrial automation controllers, aerospace avionics systems, 5G/communications infrastructure, automotive ADAS systems, and high-performance embedded vision processing.

Authentic Intel Altera components with full traceability and quality assurance. Contact us for volume pricing, lead times, and technical support.