Altera 1SX250LU3F50E2LG

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Normaler Preis Dhs. 69,193.29
Normaler Preis Dhs. 72,835.05 Verkaufspreis Dhs. 69,193.29
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1 Dhs. 69,193.29 Dhs. 69,193.29
15+ Dhs. 67,008.25 Dhs. 1,005,123.75
25+ Dhs. 65,551.55 Dhs. 1,638,788.75
50+ Dhs. 61,909.79 Dhs. 3,095,489.50
100+ Dhs. 54,626.29 Dhs. 5,462,629.00
N+ Dhs. 10,925.26 Price Inquiry
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Product attributes Property Value
Manufacturer Altera
Product Series Stratix® 10 SX
Packaging Tray | Tray
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 1.5GHz
Primary Attributes FPGA - 2500K Logic Elements
Operating Temperature 0°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 2397-BBGA, FCBGA
Supplier Device Package 2397-FBGA, FC (50x50)

Intel Altera Stratix® 10 SX FPGA System-on-Chip

The 1SX250LU3F50E2LG is a high-performance FPGA System-on-Chip from Intel's Stratix® 10 SX series, combining the flexibility of FPGA fabric with the processing power of a Quad ARM® Cortex®-A53 MPCore™ processor running at 1.5GHz. This advanced SoC delivers exceptional performance for demanding industrial, automotive, aerospace, communications, and edge computing applications.

Key Features

  • Hybrid Architecture: MCU + FPGA integration for maximum flexibility and performance
  • Powerful Processing: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ running at 1.5GHz
  • Massive Logic Capacity: 2500K logic elements for complex FPGA implementations
  • Onboard Memory: 256KB RAM for efficient data processing
  • Rich Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Industrial Temperature Range: 0°C to 100°C (TJ) for reliable operation in harsh environments
  • Advanced Packaging: 2397-FBGA, FC (50x50mm) for optimal thermal and electrical performance

Applications

Ideal for high-performance embedded systems requiring both programmable logic and processor capabilities, including industrial automation, automotive ADAS, aerospace avionics, 5G communications infrastructure, and AI/ML edge computing platforms.