Altera 1SX280LH2F55I1VG

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Normaler Preis Dhs. 123,083.17
Normaler Preis Dhs. 129,561.22 Verkaufspreis Dhs. 123,083.17
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100+ Dhs. 97,170.92 Dhs. 9,717,092.00
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Product attributes Property Value
Manufacturer Altera
Product Series Stratix® 10 SX
Packaging Tray | Tray
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 1.5GHz
Primary Attributes FPGA - 2800K Logic Elements
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 2912-BBGA, FCBGA
Supplier Device Package 2912-FBGA, FC (55x55)

Intel Stratix 10 SX FPGA System-on-Chip - 1SX280LH2F55I1VG

The Intel Stratix 10 SX 1SX280LH2F55I1VG represents the pinnacle of FPGA SoC technology, combining a powerful Quad ARM Cortex-A53 MPCore with CoreSight processor running at 1.5GHz with 2.8 million logic elements of FPGA fabric. This industrial-grade device is engineered for mission-critical applications in aerospace, automotive, communications, and edge computing environments.

Key Features & Benefits

  • High-Performance Processing: Quad ARM Cortex-A53 MPCore delivers exceptional computational power at 1.5GHz for demanding real-time applications
  • Massive FPGA Resources: 2800K logic elements provide unparalleled flexibility for custom hardware acceleration and parallel processing
  • Industrial Temperature Range: Operates reliably from -40°C to 100°C (TJ), perfect for harsh environments
  • Rich Connectivity: Integrated Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO, and EBI/EMI interfaces
  • Advanced Peripherals: Built-in DMA and WDT for efficient system management
  • Compact High-Density Package: 2912-FBGA flip-chip package (55x55mm) maximizes board space efficiency

Ideal Applications

This versatile SoC excels in applications requiring both high-performance processing and reconfigurable logic, including industrial automation, 5G infrastructure, automotive ADAS systems, aerospace avionics, medical imaging equipment, and AI/ML edge computing platforms.

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