Altera 5ASTFD3G3F35I5N

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Normaler Preis Dhs. 355,870.06
Normaler Preis Dhs. 374,600.06 Verkaufspreis Dhs. 355,870.06
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100+ Dhs. 280,950.05 Dhs. 28,095,005.00
N+ Dhs. 56,190.01 Price Inquiry
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Product attributes Property Value
Manufacturer Altera
Product Series Arria V ST
Packaging | Tray
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size -
RAM Size 64KB
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 800MHz
Primary Attributes FPGA - 350K Logic Elements
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 1152-BBGA, FCBGA
Supplier Device Package 1152-FBGA, FC (35x35)

Altera Arria V SoC FPGA - 5ASTFD3G3F35I5N

The Altera 5ASTFD3G3F35I5N is a high-performance System-on-Chip (SoC) FPGA from the Arria V ST series, combining the flexibility of FPGA fabric with the processing power of dual ARM® Cortex®-A9 MPCore™ processors with CoreSight™ technology. This advanced device delivers exceptional performance for demanding industrial, automotive, aerospace, and communications applications.

Key Features & Benefits

  • Dual ARM Cortex-A9 MPCore Processing: 800MHz dual-core ARM processors deliver robust computational performance for complex embedded applications
  • 350K Logic Elements: Extensive FPGA fabric provides flexibility for custom logic implementation and hardware acceleration
  • 64KB Integrated RAM: On-chip memory for efficient data processing and buffering
  • Industrial Temperature Range: Operates reliably from -40°C to 100°C (TJ), suitable for harsh environments
  • Rich Connectivity Options: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG interfaces for versatile system integration
  • Advanced Peripherals: DMA, POR, and WDT enhance system reliability and performance
  • Compact 1152-FBGA Package: 35mm x 35mm flip-chip BGA for space-efficient PCB designs

Ideal Applications

  • Industrial automation and control systems
  • Automotive ADAS and infotainment platforms
  • Aerospace and defense embedded systems
  • Communications infrastructure and edge computing
  • High-performance data acquisition and processing
  • Motor control and power management

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