Altera 5ASTFD5G3F35I5N
Normaler Preis
Dhs. 355,870.06
Normaler Preis
Dhs. 374,600.06
Verkaufspreis
Dhs. 355,870.06
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 355,870.06 | Dhs. 355,870.06 |
| 15+ | Dhs. 344,632.06 | Dhs. 5,169,480.90 |
| 25+ | Dhs. 337,140.05 | Dhs. 8,428,501.25 |
| 50+ | Dhs. 318,410.05 | Dhs. 15,920,502.50 |
| 100+ | Dhs. 280,950.05 | Dhs. 28,095,005.00 |
| N+ | Dhs. 56,190.01 | Price Inquiry |
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| Product attributes | Property Value |
| Manufacturer | Altera |
| Product Series | Arria V ST |
| Packaging | | Tray |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Flash Size | - |
| RAM Size | 64KB |
| Peripherals | DMA, POR, WDT |
| Connectivity | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 800MHz |
| Primary Attributes | FPGA - 462K Logic Elements |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1152-BBGA, FCBGA |
| Supplier Device Package | 1152-FBGA, FC (35x35) |
Altera Arria V SoC FPGA - 5ASTFD5G3F35I5N
The Altera 5ASTFD5G3F35I5N is a high-performance System-on-Chip (SoC) FPGA from the Arria V ST series, combining the flexibility of FPGA fabric with the processing power of dual ARM Cortex-A9 MPCore processors with CoreSight technology.
Key Features & Benefits
- Powerful Processing: Dual ARM Cortex-A9 MPCore processors running at 800MHz deliver exceptional computational performance for demanding embedded applications
- Massive Logic Capacity: 462K logic elements provide extensive programmable resources for complex digital designs and signal processing
- Rich Connectivity: Comprehensive peripheral support including Ethernet, USB OTG, SPI, I2C, UART/USART, MMC/SD/SDIO, and EBI/EMI interfaces
- Industrial-Grade Reliability: Operating temperature range of -40°C to 100°C (TJ) ensures reliable operation in harsh environments
- Advanced System Integration: Integrated DMA, POR, and WDT peripherals with 64KB on-chip RAM for efficient system design
- Compact High-Density Package: 1152-FBGA flip-chip package (35x35mm) optimizes board space while maintaining excellent thermal performance
Ideal Applications
Perfect for industrial automation, automotive systems, aerospace applications, communications infrastructure, edge computing, and high-performance embedded vision systems requiring both FPGA flexibility and processor performance.
All specifications are subject to manufacturer's datasheet. Contact us for availability, pricing, and technical support.
5ASTFD5G3F35I5N.pdf
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