Altera 5ASXBB5D4F35C5N
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 355,870.06 | Dhs. 355,870.06 |
| 15+ | Dhs. 344,632.06 | Dhs. 5,169,480.90 |
| 25+ | Dhs. 337,140.05 | Dhs. 8,428,501.25 |
| 50+ | Dhs. 318,410.05 | Dhs. 15,920,502.50 |
| 100+ | Dhs. 280,950.05 | Dhs. 28,095,005.00 |
| N+ | Dhs. 56,190.01 | Price Inquiry |
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| Product attributes | Property Value |
| Manufacturer | Altera |
| Product Series | Arria V SX |
| Packaging | | Tray |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Flash Size | - |
| RAM Size | 64KB |
| Peripherals | DMA, POR, WDT |
| Connectivity | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 800MHz |
| Primary Attributes | FPGA - 462K Logic Elements |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1152-BBGA, FCBGA |
| Supplier Device Package | 1152-FBGA, FC (35x35) |
Altera Arria V SX FPGA System-on-Chip
The 5ASXBB5D4F35C5N is a high-performance FPGA System-on-Chip from Altera's Arria V SX series, combining 462K logic elements with a powerful dual ARM® Cortex®-A9 MPCore™ processor running at 800MHz. This industrial-grade device is engineered for demanding applications in automotive, aerospace, communications, and edge computing environments.
Key Features
- Dual ARM Cortex-A9 MPCore with CoreSight: 800MHz processing power for real-time control and signal processing
- 462K Logic Elements: Extensive FPGA fabric for custom hardware acceleration and parallel processing
- 64KB RAM: On-chip memory for fast data access
- Rich Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG interfaces
- Industrial Temperature Range: Reliable operation from 0°C to 85°C (junction temperature)
- Advanced Peripherals: DMA, Power-On Reset (POR), Watchdog Timer (WDT)
Applications
Ideal for industrial automation, automotive ADAS systems, aerospace avionics, 5G/communications infrastructure, medical imaging, video processing, and AI/ML edge computing deployments requiring both programmable logic and embedded processing.
Package Information
Supplied in 1152-pin Fine-Pitch Ball Grid Array (FBGA) with flip-chip technology, 35mm × 35mm footprint. Ships in protective tray packaging to ensure device integrity during transport and storage.
Quality & Authenticity
All devices are sourced directly from authorized distributors and undergo rigorous quality verification. Full traceability documentation and authenticity certificates available upon request.
5ASXBB5D4F35C5N.pdf