Microsemi Corporation A2F060M3E-1FG256M

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Normaler Preis Dhs. 890.44
Normaler Preis Dhs. 937.30 Verkaufspreis Dhs. 890.44
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Microsemi A2F060M3E-1FG256M SmartFusion® System-on-Chip (SoC)

The A2F060M3E-1FG256M is a high-performance SmartFusion® programmable system-on-chip (SoC) from Microsemi Corporation, combining an ARM® Cortex®-M3 microcontroller with ProASIC®3 FPGA fabric. This advanced integration delivers exceptional flexibility for embedded applications requiring both processing power and programmable logic.

Key Features & Benefits

  • Dual Architecture: ARM Cortex-M3 MCU core integrated with 60K-gate FPGA fabric for maximum design flexibility
  • High Performance: 100MHz operating speed with 128KB Flash and 16KB RAM
  • Rich Connectivity: Multiple interfaces including I2C, SPI, UART/USART, and EBI/EMI for versatile system integration
  • Military-Grade Reliability: Extended temperature range (-55°C to 125°C) suitable for harsh environments
  • Advanced Peripherals: DMA, Power-On Reset (POR), and Watchdog Timer (WDT) for robust system operation
  • Compact Package: 256-FBGA (17x17mm) footprint optimized for space-constrained designs

Ideal Applications

Perfect for aerospace, defense, industrial automation, medical devices, and other mission-critical applications requiring programmable logic combined with microcontroller functionality in a single, reliable package.

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Product attributes Property Value
Manufacturer Microsemi Corporation
Product Series SmartFusion®
Packaging Tray | Tray
Architecture MCU, FPGA
Core Processor ARM® Cortex®-M3
Flash Size 128KB
RAM Size 16KB
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, I2C, SPI, UART/USART
Speed 100MHz
Primary Attributes ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Operating Temperature -55°C ~ 125°C (TJ)
Grade -
Qualification -
Package / Case 256-LBGA
Supplier Device Package 256-FPBGA (17x17)