-
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Microsemi Corporation
A2F060M3E-1FGG256I
A2F060M3E-1FGG256I
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 82.68 AED | Dhs. 82.68 AED |
| 15+ | Dhs. 80.06 AED | Dhs. 1,200.90 AED |
| 25+ | Dhs. 78.32 AED | Dhs. 1,958.00 AED |
| 50+ | Dhs. 73.97 AED | Dhs. 3,698.50 AED |
| 100+ | Dhs. 65.27 AED | Dhs. 6,527.00 AED |
| N+ | Dhs. 13.05 AED | Price Inquiry |
Verfügbarkeit für Abholungen konnte nicht geladen werden
Apply for PCBA engineering assistance
Microsemi A2F060M3E-1FGG256I SmartFusion® System-on-Chip (SoC)
The A2F060M3E-1FGG256I is a high-performance SmartFusion® system-on-chip (SoC) from Microsemi Corporation, combining an ARM® Cortex®-M3 microcontroller with a ProASIC®3 FPGA fabric. This integrated architecture delivers flexible, programmable logic alongside robust embedded processing for aerospace, automotive, industrial, medical, and telecom applications requiring high reliability and long lifecycle support.
Key Features
- Dual Architecture: ARM Cortex-M3 MCU + 60K gate ProASIC®3 FPGA with 1,536 D-flip-flops
- Processing Speed: 100MHz core frequency for real-time control and signal processing
- Memory: 128KB Flash + 16KB RAM for program and data storage
- Connectivity: EBI/EMI, I²C, SPI, UART/USART interfaces for versatile system integration
- Peripherals: DMA, Power-On Reset (POR), Watchdog Timer (WDT)
- Industrial Temperature Range: -40°C to +100°C (TJ) for harsh environments
- Package: 256-LBGA / 256-FPBGA (17×17mm) for compact board designs
Applications
Ideal for motor control, sensor fusion, industrial automation, medical instrumentation, and embedded vision systems where FPGA acceleration and MCU control are required in a single device.
Design Support
Full traceability, RoHS/REACH compliance, datasheets, reference designs, and technical resources available to support design-in and production sourcing.
Complete Technical Specifications
| Product attributes | Property Value |
| Manufacturer | Microsemi Corporation |
| Product Series | SmartFusion® |
| Packaging | Tray | |
| Part Status | Obsolete |
| Architecture | MCU, FPGA |
| Core Processor | ARM® Cortex®-M3 |
| Flash Size | 128KB |
| RAM Size | 16KB |
| Peripherals | DMA, POR, WDT |
| Connectivity | EBI/EMI, I2C, SPI, UART/USART |
| Speed | 100MHz |
| Primary Attributes | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 256-LBGA |
| Supplier Device Package | 256-FPBGA (17x17) |
Datasheets:
A2F060M3E-1FGG256I
.pdf
