Microsemi Corporation A2F060M3E-1FGG256M

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Normaler Preis Dhs. 890.44
Normaler Preis Dhs. 937.30 Verkaufspreis Dhs. 890.44
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15+ Dhs. 862.32 Dhs. 12,934.80
25+ Dhs. 843.57 Dhs. 21,089.25
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100+ Dhs. 702.98 Dhs. 70,298.00
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Microsemi A2F060M3E-1FGG256M SmartFusion® FPSLIC

The A2F060M3E-1FGG256M is a high-performance System-on-Chip (SoC) combining an ARM® Cortex®-M3 microcontroller with ProASIC®3 FPGA fabric, delivering exceptional flexibility and processing power for embedded applications requiring both programmable logic and microcontroller functionality.

Key Features:

  • Dual Architecture: ARM Cortex-M3 MCU integrated with 60K Gates FPGA
  • High Performance: 100MHz operating speed for demanding applications
  • Memory: 128KB Flash + 16KB RAM
  • Extended Temperature Range: -55°C to 125°C (TJ) for industrial and military applications
  • Rich Connectivity: I2C, SPI, UART/USART, EBI/EMI interfaces
  • Advanced Peripherals: DMA, POR, WDT
  • Compact Package: 256-FPBGA (17x17mm)

Applications:

Ideal for aerospace, defense, industrial automation, medical devices, and other mission-critical applications requiring programmable logic combined with microcontroller processing.

Why Choose Us: We supply only genuine Microsemi components with full traceability, competitive pricing, and fast worldwide shipping. All parts are quality-tested and backed by our authenticity guarantee.

Product attributes Property Value
Manufacturer Microsemi Corporation
Product Series SmartFusion®
Packaging Tray | Tray
Architecture MCU, FPGA
Core Processor ARM® Cortex®-M3
Flash Size 128KB
RAM Size 16KB
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, I2C, SPI, UART/USART
Speed 100MHz
Primary Attributes ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Operating Temperature -55°C ~ 125°C (TJ)
Grade -
Qualification -
Package / Case 256-LBGA
Supplier Device Package 256-FPBGA (17x17)