Microchip Technology A2F500M3G-FG256M

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Normaler Preis Dhs. 355,870.06
Normaler Preis Dhs. 374,600.06 Verkaufspreis Dhs. 355,870.06
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15+ Dhs. 344,632.06 Dhs. 5,169,480.90
25+ Dhs. 337,140.05 Dhs. 8,428,501.25
50+ Dhs. 318,410.05 Dhs. 15,920,502.50
100+ Dhs. 280,950.05 Dhs. 28,095,005.00
N+ Dhs. 56,190.01 Price Inquiry
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SmartFusion® A2F500M3G-FG256M - Advanced System-on-Chip FPGA Solution

The A2F500M3G-FG256M from Microchip Technology represents a breakthrough in embedded system design, combining a powerful ARM® Cortex®-M3 microcontroller with a 500K-gate ProASIC®3 FPGA fabric in a single, integrated System-on-Chip (SoC). This SmartFusion® device delivers unparalleled flexibility for industrial control, aerospace instrumentation, automotive systems, and mission-critical edge computing applications.

Key Features & Benefits

  • Dual-Architecture Performance: ARM Cortex-M3 MCU core running at 80MHz paired with 500K gates of reconfigurable FPGA logic
  • Generous Memory Resources: 512KB Flash and 64KB RAM for complex application code and data buffering
  • Rich Peripheral Set: DMA, POR, WDT, plus comprehensive connectivity via Ethernet, I²C, SPI, UART/USART, and EBI/EMI interfaces
  • Extended Temperature Range: Operates reliably from -55°C to +125°C (TJ), ideal for harsh industrial and aerospace environments
  • Compact 256-FBGA Package: 17x17mm footprint optimizes board space while maintaining robust I/O capability
  • 11,520 D-Flip-Flops: Extensive logic resources for custom digital signal processing, protocol bridging, and real-time control

Ideal Applications

This SmartFusion SoC excels in applications requiring deterministic real-time processing, hardware acceleration, and secure embedded control—including motor drives, industrial automation, avionics, communications infrastructure, and ruggedized edge AI inference.

Product attributes Property Value
Manufacturer Microchip Technology
Product Series SmartFusion®
Packaging | Tray
Architecture MCU, FPGA
Core Processor ARM® Cortex®-M3
Flash Size 512KB
RAM Size 64KB
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
Speed 80MHz
Primary Attributes ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Operating Temperature -55°C ~ 125°C (TJ)
Grade -
Qualification -
Package / Case 256-LBGA
Supplier Device Package 256-FPBGA (17x17)

No datasheet available. Please contact sales@hqickey.com for the latest datasheet.