Microsemi Corporation A3P250L-PQG208
Normaler Preis
Dhs. 100.89
Normaler Preis
Dhs. 106.20
Verkaufspreis
Dhs. 100.89
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 100.89 | Dhs. 100.89 |
| 15+ | Dhs. 97.70 | Dhs. 1,465.50 |
| 25+ | Dhs. 95.58 | Dhs. 2,389.50 |
| 50+ | Dhs. 90.27 | Dhs. 4,513.50 |
| 100+ | Dhs. 79.65 | Dhs. 7,965.00 |
| N+ | Dhs. 15.93 | Price Inquiry |
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Microsemi A3P250L-PQG208 ProASIC3L FPGA
The A3P250L-PQG208 is a high-performance, low-power FPGA from Microsemi's ProASIC3L family, designed for industrial, automotive, aerospace, and edge computing applications. With 250,000 gates and 151 I/O pins, this device delivers exceptional flexibility and integration capabilities in a compact 208-pin PQFP package.
Key Features
- 250,000 System Gates – Ample logic resources for complex digital designs
- 151 User I/O Pins – High pin count for extensive connectivity
- 36,864 RAM Bits – Embedded memory for buffering and data storage
- Low Power Operation – 1.14V to 1.575V supply voltage for energy-efficient designs
- Industrial Temperature Range – Operates reliably from 0°C to 85°C (TJ)
- Surface Mount 208-PQFP Package – Compact 28x28mm footprint for space-constrained designs
Applications
Ideal for industrial control systems, automotive electronics, communications infrastructure, signal processing, and embedded system prototyping where low power consumption, reliability, and high I/O density are critical.
| Product attributes | Property Value |
| Manufacturer | Microsemi Corporation |
| Product Series | ProASIC3L |
| Packaging | Tray | Tray |
| Number of LABs/CLBs | - |
| Number of Logic Elements/Cells | - |
| Total RAM Bits | 36864 |
| Number of I/O | 151 |
| Number of Gates | 250000 |
| Voltage - Supply | 1.14V ~ 1.575V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 208-BFQFP |
| Supplier Device Package | 208-PQFP (28x28) |
No datasheet available. Please contact sales@hqickey.com for the latest datasheet.
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