Microsemi Corporation AFS090-1FGG256I

Zu Produktinformationen springen
1 von 1
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Normaler Preis Dhs. 325.08
Normaler Preis Dhs. 342.20 Verkaufspreis Dhs. 325.08
Sale Ausverkauft
Quantity Unit Price Total Price
1 Dhs. 325.08 Dhs. 325.08
15+ Dhs. 314.82 Dhs. 4,722.30
25+ Dhs. 307.98 Dhs. 7,699.50
50+ Dhs. 290.87 Dhs. 14,543.50
100+ Dhs. 256.65 Dhs. 25,665.00
N+ Dhs. 51.33 Price Inquiry
Versand wird beim Checkout berechnet
Anzahl
Component Recycling

Request Quote / Inquiry

Microsemi AFS090-1FGG256I Fusion® Mixed-Signal FPGA

The AFS090-1FGG256I is a high-performance mixed-signal FPGA from Microsemi's Fusion® family, designed for demanding industrial applications requiring both programmable logic and analog functionality. With 90,000 gates and 75 I/O pins in a compact 256-FBGA package, this device delivers exceptional flexibility for embedded system designs.

Key Features

  • 90,000 gates of programmable logic capacity
  • 75 I/O pins for versatile connectivity
  • 27,648 RAM bits for on-chip data storage
  • Industrial temperature range: -40°C to 100°C (TJ)
  • Low power operation: 1.425V ~ 1.575V supply voltage
  • Surface mount 256-LBGA/FBGA package (17x17mm)

Applications

Ideal for aerospace, automotive, industrial control systems, telecommunications infrastructure, and medical equipment requiring reliable mixed-signal processing with long lifecycle support.

Why Choose This Component: As an authorized distributor, we provide genuine Microsemi components with full traceability, technical support, and long lifecycle commitment. Perfect for design-in applications requiring reliability and compliance.

Product attributes Property Value
Manufacturer Microsemi Corporation
Product Series Fusion®
Packaging Tray | Tray
Number of LABs/CLBs -
Number of Logic Elements/Cells -
Total RAM Bits 27648
Number of I/O 75
Number of Gates 90000
Voltage - Supply 1.425V ~ 1.575V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 256-LBGA
Supplier Device Package 256-FPBGA (17x17)