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Normaler Preis Dhs. 109.91
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15+ Dhs. 106.43 Dhs. 1,596.45
25+ Dhs. 104.11 Dhs. 2,602.75
50+ Dhs. 98.33 Dhs. 4,916.50
100+ Dhs. 86.76 Dhs. 8,676.00
N+ Dhs. 17.35 Price Inquiry
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Microsemi Fusion® AFS090-2QNG108 Mixed-Signal FPGA

The AFS090-2QNG108 is a high-performance mixed-signal FPGA from Microsemi's Fusion® family, designed for demanding industrial, automotive, aerospace, and communications applications. This advanced System-on-Chip (SoC) solution combines 90,000 gates of FPGA fabric with integrated analog and digital peripherals, delivering exceptional flexibility and performance in a compact 108-pin QFN package.

Key Features & Benefits

  • 90,000 Gates - Ample logic resources for complex digital designs and signal processing
  • 37 I/O Pins - Flexible connectivity for interfacing with sensors, actuators, and communication buses
  • 27,648 RAM Bits - On-chip memory for data buffering and processing
  • Surface Mount 108-WFQFN Package - Space-efficient 8x8mm footprint ideal for compact designs
  • Wide Operating Temperature Range - Reliable operation from 0°C to 85°C (TJ) for industrial environments
  • Low Power Supply Voltage - 1.425V to 1.575V for energy-efficient operation

Ideal Applications

Perfect for edge computing, motor control, sensor fusion, industrial automation, automotive electronics, and aerospace systems requiring mixed-signal processing capabilities with FPGA programmability.

Backed by Microsemi's reputation for quality and reliability, this FPGA delivers the performance and flexibility your next-generation embedded system demands.

Product attributes Property Value
Manufacturer Microsemi Corporation
Product Series Fusion®
Packaging Tray | Tray
Number of LABs/CLBs -
Number of Logic Elements/Cells -
Total RAM Bits 27648
Number of I/O 37
Number of Gates 90000
Voltage - Supply 1.425V ~ 1.575V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Grade -
Qualification -
Package / Case 108-WFQFN
Supplier Device Package 108-QFN (8x8)