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Normaler Preis Dhs. 114.33
Normaler Preis Dhs. 120.37 Verkaufspreis Dhs. 114.33
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1 Dhs. 114.33 Dhs. 114.33
15+ Dhs. 110.74 Dhs. 1,661.10
25+ Dhs. 108.33 Dhs. 2,708.25
50+ Dhs. 102.31 Dhs. 5,115.50
100+ Dhs. 90.28 Dhs. 9,028.00
N+ Dhs. 18.06 Price Inquiry
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Microsemi AFS090-2QNG180 Fusion® Mixed-Signal FPGA

The AFS090-2QNG180 is a high-performance mixed-signal FPGA from Microsemi's Fusion® family, designed for demanding industrial and embedded applications. This versatile device combines 90,000 gates with 60 I/O pins in a compact 180-QFN (10x10mm) surface-mount package, making it ideal for space-constrained designs requiring both digital logic and analog integration.

Key Features

  • 90,000 Logic Gates - Ample resources for complex digital designs
  • 60 I/O Pins - Flexible connectivity for diverse applications
  • 27,648 RAM Bits - On-chip memory for data buffering and processing
  • Industrial Temperature Range - Reliable operation from 0°C to 85°C (TJ)
  • Compact 180-QFN Package - Space-efficient 10x10mm dual-row design with exposed pad
  • Low Power Operation - 1.425V to 1.575V supply voltage

Applications

Perfect for automotive electronics, industrial control systems, communications infrastructure, aerospace instrumentation, and edge computing platforms requiring mixed-signal processing capabilities.

All specifications are subject to manufacturer's datasheet. Contact us for volume pricing and technical support.

Product attributes Property Value
Manufacturer Microsemi Corporation
Product Series Fusion®
Packaging Tray | Tray
Number of LABs/CLBs -
Number of Logic Elements/Cells -
Total RAM Bits 27648
Number of I/O 60
Number of Gates 90000
Voltage - Supply 1.425V ~ 1.575V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Grade -
Qualification -
Package / Case 180-WFQFN Dual Rows, Exposed Pad
Supplier Device Package 180-QFN (10x10)