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AFS250-1FG256 - Microchip Fusion Mixed-Signal FPGA

The AFS250-1FG256 is a high-performance Field Programmable Gate Array (FPGA) from Microchip Technology's renowned Fusion® series. This advanced mixed-signal FPGA combines programmable logic with analog functionality, making it ideal for embedded systems, industrial control applications, and complex digital designs requiring both digital and analog signal processing capabilities.

Key Features & Benefits

  • 250,000 Gates - Ample logic resources for complex digital designs and system integration
  • 114 I/O Pins - Extensive connectivity options for interfacing with multiple peripherals and systems
  • 36,864 RAM Bits - Integrated memory for data buffering and storage applications
  • Mixed-Signal Architecture - Combines FPGA logic with analog capabilities for versatile system design
  • Surface Mount Package - 256-FBGA (17x17mm) for compact PCB layouts and automated assembly
  • Industrial Temperature Range - Operates reliably from 0°C to 85°C (TJ) for demanding environments
  • Low Voltage Operation - 1.425V to 1.575V supply voltage for power-efficient designs

Applications

Perfect for industrial automation, motor control systems, sensor interfaces, data acquisition systems, embedded computing, and mixed-signal processing applications where both digital logic and analog functionality are required.

Why Choose HQICKEY?

At HQICKEY, we guarantee 100% authentic semiconductor components with full manufacturer warranty support. All products are sourced directly from authorized distributors and undergo strict quality verification. We offer global shipping and expert technical support to ensure your project success.

Related Products & Resources

Explore our complete range of FPGAs Field Programmable Gate Array ICs for more FPGA solutions. Visit HQICKEY to browse our full catalog of authentic semiconductor components. For technical articles, design guides, and industry insights, check out our News & Technical Blog.

Product attributes Property Value
Manufacturer Microchip Technology
Product Series Fusion®
Packaging Tray | Tray
Number of LABs/CLBs -
Number of Logic Elements/Cells -
Total RAM Bits 36864
Number of I/O 114
Number of Gates 250000
Voltage - Supply 1.425V ~ 1.575V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Grade -
Qualification -
Package / Case 256-LBGA
Supplier Device Package 256-FPBGA (17x17)

No datasheet available. Please contact sales@hqickey.com for the latest datasheet.