Microchip Technology AFS250-1FG256I

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Microchip AFS250-1FG256I Fusion FPGA - High-Performance Mixed-Signal Solution

The AFS250-1FG256I from Microchip Technology is a powerful member of the Fusion® family, delivering exceptional mixed-signal FPGA capabilities for demanding embedded applications. This industrial-grade component combines 250,000 gates with 114 I/O pins in a compact 256-FBGA package, making it ideal for space-constrained designs requiring robust performance.

Key Features & Benefits

  • High Gate Density: 250,000 gates provide ample logic resources for complex digital designs
  • Flexible I/O: 114 configurable I/O pins enable versatile connectivity options
  • Embedded Memory: 36,864 RAM bits for efficient data buffering and storage
  • Industrial Temperature Range: Operates reliably from -40°C to 100°C (TJ) for harsh environments
  • Compact Footprint: 256-FPBGA (17x17mm) surface mount package saves board space
  • Stable Power Supply: 1.425V to 1.575V operating voltage for consistent performance

Ideal Applications

This Fusion FPGA excels in industrial control systems, automotive electronics, medical devices, telecommunications equipment, and aerospace applications where reliability and mixed-signal integration are critical.

Authentic Components with Global Support

At HQICKEY, we guarantee 100% authentic Microchip components with full manufacturer warranty. Every AFS250-1FG256I undergoes rigorous quality verification before shipping to ensure you receive genuine parts for your critical projects.

Why Choose FPGAs for Your Design?

Field Programmable Gate Arrays offer unmatched flexibility for hardware acceleration, real-time processing, and custom logic implementation. Unlike fixed-function ASICs, FPGAs can be reconfigured to adapt to evolving requirements, reducing development costs and time-to-market.

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Order with confidence: Fast global shipping, authentic warranty support, and expert technical assistance for all your FPGA needs.

Product attributes Property Value
Manufacturer Microchip Technology
Product Series Fusion®
Packaging Tray | Tray
Number of LABs/CLBs -
Number of Logic Elements/Cells -
Total RAM Bits 36864
Number of I/O 114
Number of Gates 250000
Voltage - Supply 1.425V ~ 1.575V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 256-LBGA
Supplier Device Package 256-FPBGA (17x17)

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