Microsemi Corporation AFS250-1PQG208I
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 355,880.72 | Dhs. 355,880.72 |
| 15+ | Dhs. 344,642.38 | Dhs. 5,169,635.70 |
| 25+ | Dhs. 337,150.15 | Dhs. 8,428,753.75 |
| 50+ | Dhs. 318,419.59 | Dhs. 15,920,979.50 |
| 100+ | Dhs. 280,958.46 | Dhs. 28,095,846.00 |
| N+ | Dhs. 56,191.69 | Price Inquiry |
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| Product attributes | Property Value |
| Manufacturer | Microsemi Corporation |
| Product Series | Fusion® |
| Packaging | | Tray |
| Number of LABs/CLBs | - |
| Number of Logic Elements/Cells | - |
| Total RAM Bits | 36864 |
| Number of I/O | 93 |
| Number of Gates | 250000 |
| Voltage - Supply | 1.425V ~ 1.575V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 208-BFQFP |
| Supplier Device Package | 208-PQFP (28x28) |
Microsemi AFS250-1PQG208I - Fusion® Mixed-Signal FPGA
The AFS250-1PQG208I from Microsemi Corporation is a high-performance Fusion® series Field Programmable Gate Array (FPGA) designed for demanding industrial and embedded applications. This advanced mixed-signal FPGA combines 250,000 gates with integrated analog functionality, making it ideal for aerospace, automotive, industrial control, medical devices, and telecommunications systems.
Key Features & Benefits
- 250,000 Logic Gates - Provides substantial processing power for complex digital designs
- 93 I/O Pins - Flexible connectivity options for interfacing with various peripherals and systems
- 36,864 RAM Bits - Embedded memory for efficient data storage and buffering
- Industrial Temperature Range - Operates reliably from -40°C to 100°C (TJ), perfect for harsh environments
- Low Power Operation - 1.425V to 1.575V supply voltage for energy-efficient designs
- Surface Mount Technology - 208-PQFP (28x28mm) package for automated assembly and compact PCB layouts
Applications
This FPGA is perfectly suited for high-reliability applications including motor control systems, sensor interfaces, data acquisition systems, embedded processing, industrial automation, medical instrumentation, and telecommunications infrastructure. The Fusion architecture's mixed-signal capabilities enable seamless integration of analog and digital functions on a single chip.
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AFS250-1PQG208I.pdf