Microchip Technology AFS600-1FG256I

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Microchip AFS600-1FG256I Fusion FPGA - High-Performance Field Programmable Gate Array

The AFS600-1FG256I from Microchip Technology is a powerful member of the Fusion® FPGA family, designed for embedded applications requiring high gate density and reliable performance across industrial temperature ranges. This field-programmable gate array delivers 600,000 gates with 119 I/O pins in a compact 256-FBGA package, making it ideal for complex digital logic implementations, signal processing, and mixed-signal applications.

Key Features & Benefits

  • 600,000 Gates - Ample logic resources for sophisticated embedded designs
  • 119 I/O Pins - Extensive connectivity for interfacing with multiple peripherals
  • 110,592 RAM Bits - Integrated memory for data buffering and storage
  • Industrial Temperature Range - Operates reliably from -40°C to 100°C (TJ)
  • Low Power Operation - 1.425V to 1.575V supply voltage for energy-efficient designs
  • Surface Mount Package - 256-LBGA/256-FPBGA (17x17mm) for automated assembly

Applications

The AFS600-1FG256I is perfectly suited for industrial control systems, automotive electronics, telecommunications infrastructure, medical devices, and aerospace applications where reliability and performance are critical. Its robust temperature range and comprehensive I/O capabilities make it an excellent choice for harsh environment deployments.

Why Choose HQICKEY?

At HQICKEY, we guarantee 100% authentic components with full manufacturer warranty support. Every AFS600-1FG256I ships with proper documentation and quality assurance. We offer global shipping and expert technical support to help you succeed with your embedded hardware projects.

Related Products & Resources

Explore our complete selection of FPGAs - Field Programmable Gate Array ICs for more options from leading manufacturers. Stay updated with the latest semiconductor industry news, technical guides, and product announcements on our News & Technical Blog.

Product attributes Property Value
Manufacturer Microchip Technology
Product Series Fusion®
Packaging Tray | Tray
Number of LABs/CLBs -
Number of Logic Elements/Cells -
Total RAM Bits 110592
Number of I/O 119
Number of Gates 600000
Voltage - Supply 1.425V ~ 1.575V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 256-LBGA
Supplier Device Package 256-FPBGA (17x17)

No datasheet available. Please contact sales@hqickey.com for the latest datasheet.