Altera AGFA019R31C2I3E
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 90,785.34 | Dhs. 90,785.34 |
| 15+ | Dhs. 87,918.43 | Dhs. 1,318,776.45 |
| 25+ | Dhs. 86,007.16 | Dhs. 2,150,179.00 |
| 50+ | Dhs. 81,228.98 | Dhs. 4,061,449.00 |
| 100+ | Dhs. 71,672.63 | Dhs. 7,167,263.00 |
| N+ | Dhs. 14,334.53 | Price Inquiry |
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Altera AGFA019R31C2I3E - Agilex F Series FPGA System-on-Chip
The Altera AGFA019R31C2I3E is a high-performance FPGA System-on-Chip (SoC) from the Agilex F series, combining advanced FPGA fabric with embedded ARM processing for demanding aerospace, automotive, industrial, and telecommunications applications.
Key Features
- 1.9M Logic Elements - Massive programmable logic capacity for complex designs
- Quad ARM Cortex-A53 MPCore with CoreSight, NEON, and floating-point acceleration running at 1.4GHz
- 256KB integrated RAM for embedded processing
- Rich connectivity: Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO, EBI/EMI
- Industrial temperature range: -40°C to 100°C (TJ) for harsh environments
- 3184-BFBGA package (56x45mm) with exposed pad for superior thermal performance
Applications
Ideal for high-bandwidth data processing, embedded vision, 5G wireless infrastructure, industrial automation, automotive ADAS, aerospace systems, and edge AI acceleration requiring both FPGA flexibility and ARM processing power.
Why Choose This FPGA SoC?
The Agilex F architecture delivers exceptional performance-per-watt with heterogeneous 3D SiP technology, second-generation HyperFlex core fabric, and hardened IP blocks. This device provides the processing headroom and I/O bandwidth needed for next-generation designs while maintaining long lifecycle availability and full manufacturer traceability.
Authorized Distributor - All units ship with full manufacturer documentation, traceability, and warranty support. Long lifecycle availability guaranteed for program continuity.
| Product attributes | Property Value |
| Manufacturer | Altera |
| Product Series | Agilex F |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MPU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 1.4GHz |
| Primary Attributes | FPGA - 1.9M Logic Elements |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 3184-BFBGA Exposed Pad |
| Supplier Device Package | 3184-BGA (56x45) |
AGFA019R31C2I3E.pdf