Altera AGFA023R24C3E3V

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Normaler Preis Dhs. 43,850.65
Normaler Preis Dhs. 46,158.56 Verkaufspreis Dhs. 43,850.65
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Altera AGFA023R24C3E3V - Agilex F Series FPGA System-on-Chip

The AGFA023R24C3E3V from Altera represents a high-performance FPGA SoC solution combining 2.3 million logic elements with a powerful Quad ARM® Cortex®-A53 MPCore™ processor running at 1.4GHz. This advanced device integrates FPGA flexibility with embedded processing capabilities, making it ideal for aerospace, automotive, industrial automation, medical equipment, and telecommunications applications requiring high reliability and long lifecycle support.

Key Features & Benefits

  • Hybrid Architecture: MPU + FPGA design enables hardware acceleration alongside embedded processing
  • High-Performance Processing: Quad ARM Cortex-A53 with NEON, floating point, and CoreSight debug
  • Massive Logic Capacity: 2.3M logic elements for complex FPGA implementations
  • Rich Connectivity: Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO, EBI/EMI interfaces
  • Industrial Temperature Range: 0°C to 100°C (TJ) for demanding environments
  • Compact BGA Package: 2340-pin BGA (45x42mm) with exposed pad for thermal management

Applications

This FPGA SoC is designed for mission-critical applications in aerospace and defense systems, automotive ADAS and infotainment, industrial control and automation, medical imaging and diagnostics, 5G/telecom infrastructure, and high-performance embedded computing platforms requiring long-term availability and full component traceability.

Quality & Compliance

All components are sourced through authorized distribution channels with full manufacturer traceability. RoHS and REACH compliant. Long lifecycle commitment ensures availability for multi-year design cycles in aerospace, automotive, industrial, medical, and telecom segments.

Product attributes Property Value
Manufacturer Altera
Product Series Agilex F
Packaging Tray |
Part Status Active
Architecture MPU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 1.4GHz
Primary Attributes FPGA - 2.3M Logic Elements
Operating Temperature 0°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 2340-BFBGA Exposed Pad
Supplier Device Package 2340-BGA (45x42)

No datasheet available. Please contact sales@hqickey.com for the latest datasheet.