Altera AGFB019R24C2E1V
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 74,979.06 | Dhs. 74,979.06 |
| 15+ | Dhs. 72,611.29 | Dhs. 1,089,169.35 |
| 25+ | Dhs. 71,032.78 | Dhs. 1,775,819.50 |
| 50+ | Dhs. 67,086.51 | Dhs. 3,354,325.50 |
| 100+ | Dhs. 59,193.98 | Dhs. 5,919,398.00 |
| N+ | Dhs. 11,838.80 | Price Inquiry |
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| Product attributes | Property Value |
| Manufacturer | Altera |
| Product Series | Agilex F |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MPU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 1.4GHz |
| Primary Attributes | FPGA - 1.9M Logic Elements |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 2340-BFBGA Exposed Pad |
| Supplier Device Package | 2340-BGA (45x42) |
Altera AGFB019R24C2E1V - Agilex F Series FPGA System-on-Chip
The AGFB019R24C2E1V from Altera represents a high-performance FPGA SoC solution combining the flexibility of programmable logic with the processing power of embedded ARM processors. This Agilex F series device delivers exceptional performance for demanding applications in aerospace, automotive, telecommunications, industrial automation, and advanced computing systems.
Key Features & Benefits
- Powerful Processing: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ running at 1.4GHz provides robust embedded processing capabilities
- Massive Logic Capacity: 1.9 million logic elements enable complex FPGA designs and parallel processing architectures
- Advanced Architecture: Hybrid MPU/FPGA design with ARM NEON and floating-point support for signal processing and compute-intensive tasks
- Rich Connectivity: Comprehensive peripheral set including Ethernet, USB OTG, MMC/SD/SDIO, SPI, I2C, UART/USART, and EBI/EMI interfaces
- Industrial Temperature Range: Qualified for 0°C to 100°C (TJ) operation ensuring reliability in harsh environments
- High-Density Package: 2340-BGA (45x42mm) with exposed pad for enhanced thermal performance
Ideal Applications
This SoC is engineered for applications requiring high-performance programmable logic combined with embedded processing, including 5G wireless infrastructure, industrial IoT gateways, advanced driver assistance systems (ADAS), medical imaging equipment, aerospace avionics, and high-speed data acquisition systems.
Quality & Traceability
All units are sourced directly from authorized distributors with full manufacturer traceability. Each device includes complete documentation, compliance certifications (RoHS/REACH), and is backed by our quality guarantee. We support long lifecycle programs for aerospace, automotive, and industrial applications requiring extended product availability.
No datasheet available. Please contact sales@hqickey.com for the latest datasheet.
