Altera AGFB019R31C2E3E

Zu Produktinformationen springen
1 von 1
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Normaler Preis Dhs. 75,718.01
Normaler Preis Dhs. 79,703.17 Verkaufspreis Dhs. 75,718.01
Sale Ausverkauft
Quantity Unit Price Total Price
1 Dhs. 75,718.01 Dhs. 75,718.01
15+ Dhs. 73,326.92 Dhs. 1,099,903.80
25+ Dhs. 71,732.85 Dhs. 1,793,321.25
50+ Dhs. 67,747.69 Dhs. 3,387,384.50
100+ Dhs. 59,777.38 Dhs. 5,977,738.00
N+ Dhs. 11,955.48 Price Inquiry
Versand wird beim Checkout berechnet
Anzahl
Component Recycling

Request Quote / Inquiry

Intel Altera Agilex F Series FPGA System-on-Chip

The AGFB019R31C2E3E is a high-performance FPGA SoC from Intel's Agilex F series, combining powerful ARM processing with massive FPGA fabric for demanding industrial, automotive, aerospace, and communications applications.

Key Features

  • Quad ARM Cortex-A53 MPCore with CoreSight, NEON, and floating-point acceleration running at 1.4GHz
  • 1.9 Million Logic Elements for complex FPGA designs and parallel processing
  • 256KB RAM with DMA and watchdog timer peripherals
  • Rich Connectivity: Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO, EBI/EMI
  • Industrial Temperature Range: 0°C to 100°C (TJ) for reliable operation in harsh environments
  • 3184-BGA Package (56x45mm) with exposed pad for superior thermal performance

Applications

Ideal for edge computing, 5G infrastructure, industrial automation, automotive ADAS, aerospace systems, and high-speed data processing applications requiring both programmable logic and embedded processing power.

Why Choose AGFB019R31C2E3E?

This Agilex F SoC delivers exceptional performance-per-watt with Intel's advanced 10nm SuperFin process technology, offering the flexibility of FPGA fabric combined with the efficiency of hardened ARM processors. Perfect for next-generation systems requiring adaptive computing, real-time processing, and high-bandwidth I/O.

Product attributes Property Value
Manufacturer Altera
Product Series Agilex F
Packaging Tray | Tray
Architecture MPU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 1.4GHz
Primary Attributes FPGA - 1.9M Logic Elements
Operating Temperature 0°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 3184-BFBGA Exposed Pad
Supplier Device Package 3184-BGA (56x45)

No datasheet available. Please contact sales@hqickey.com for the latest datasheet.