Altera AGFB019R31C2I3E

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Intel Altera Agilex F Series FPGA System-on-Chip

The AGFB019R31C2I3E is a high-performance FPGA System-on-Chip from Intel's Altera Agilex F series, combining powerful ARM processing with massive FPGA fabric capacity. This device delivers exceptional performance for demanding industrial, automotive, aerospace, communications, and edge computing applications.

Key Features

  • Quad ARM Cortex-A53 MPCore processor with CoreSight, NEON, and floating-point support running at 1.4GHz
  • 1.9 Million Logic Elements providing extensive FPGA fabric for complex designs
  • 256KB RAM for embedded processing tasks
  • Industrial Temperature Range: -40°C to 100°C (TJ) for harsh environments
  • Rich Connectivity: Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO, EBI/EMI
  • Advanced Peripherals: DMA, Watchdog Timer (WDT)
  • Compact 3184-BGA Package (56x45mm) with exposed pad for thermal management

Applications

Ideal for high-performance embedded systems requiring both processing power and FPGA flexibility, including industrial automation, automotive ADAS, aerospace avionics, 5G/communications infrastructure, AI/ML edge computing, and high-speed data acquisition systems.

Why Choose AGFB019R31C2I3E?

This Agilex F device represents Intel's latest FPGA technology, offering superior performance-per-watt, advanced security features, and seamless integration between hard processor system and FPGA fabric. Perfect for engineers developing next-generation embedded systems requiring both deterministic processing and reconfigurable logic.

Genuine Intel Altera components with full traceability and warranty support.

Product attributes Property Value
Manufacturer Altera
Product Series Agilex F
Packaging Tray | Tray
Architecture MPU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 1.4GHz
Primary Attributes FPGA - 1.9M Logic Elements
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 3184-BFBGA Exposed Pad
Supplier Device Package 3184-BGA (56x45)

No datasheet available. Please contact sales@hqickey.com for the latest datasheet.