Altera AGFB023R24C3E3E

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Altera AGFB023R24C3E3E - Agilex F Series FPGA with Integrated ARM Processing

The AGFB023R24C3E3E is a high-performance System-on-Chip (SoC) FPGA from Altera's Agilex F family, combining 2.3 million logic elements with a powerful Quad ARM® Cortex®-A53 MPCore™ processor. This advanced device delivers exceptional processing capabilities for demanding aerospace, automotive, industrial, and telecommunications applications.

Key Features

  • Massive Logic Capacity: 2.3M logic elements for complex FPGA designs
  • High-Performance Processing: Quad ARM Cortex-A53 MPCore with CoreSight, ARM NEON, and floating-point support running at 1.4GHz
  • Integrated Memory: 256KB on-chip RAM for efficient data processing
  • Rich Connectivity: Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO, and EBI/EMI interfaces
  • Industrial Temperature Range: Operates reliably from 0°C to 100°C (TJ)
  • Advanced Packaging: 2340-BFBGA (45x42mm) with exposed pad for superior thermal performance

Applications

Ideal for high-density FPGA solutions in aerospace systems, automotive electronics, industrial automation, telecommunications infrastructure, and other mission-critical applications requiring both programmable logic and embedded processing power.

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Sourced from authorized distributors with full manufacturer documentation, traceability, and long lifecycle support. Every unit ships with complete technical specifications and compliance certifications.

Product attributes Property Value
Manufacturer Altera
Product Series Agilex F
Packaging Tray |
Part Status Active
Architecture MPU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 1.4GHz
Primary Attributes FPGA - 2.3M Logic Elements
Operating Temperature 0°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 2340-BFBGA Exposed Pad
Supplier Device Package 2340-BGA (45x42)

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