Altera AGFC023R31C3I3E

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Normaler Preis Dhs. 82,752.92
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Altera AGFC023R31C3I3E - Agilex F Series FPGA SoC

The AGFC023R31C3I3E from Altera represents a high-performance System-on-Chip (SoC) solution combining a powerful Quad ARM® Cortex®-A53 MPCore™ processor with a massive 2.3M logic element FPGA fabric. This Agilex F series device delivers exceptional processing power at 1.4GHz with ARM NEON and floating-point capabilities, making it ideal for demanding applications in aerospace, automotive, telecommunications, industrial automation, and medical equipment.

Key Features & Benefits

  • Hybrid Architecture: MPU + FPGA integration enables flexible hardware acceleration and real-time processing
  • High Logic Density: 2.3 million logic elements provide extensive programmable resources for complex designs
  • Robust Connectivity: Comprehensive peripheral support including Ethernet, USB OTG, MMC/SD/SDIO, SPI, I2C, UART/USART, and EBI/EMI interfaces
  • Industrial Temperature Range: -40°C to 100°C (TJ) operation ensures reliability in harsh environments
  • Advanced Processing: Quad-core ARM Cortex-A53 with CoreSight™ debug, 256KB RAM, DMA, and watchdog timer
  • Compact High-Density Package: 3184-BFBGA (56x45mm) with exposed pad for superior thermal performance

Target Applications

This SoC FPGA is engineered for applications requiring both high-performance processing and programmable logic, including 5G wireless infrastructure, advanced driver assistance systems (ADAS), industrial IoT edge computing, medical imaging systems, and aerospace/defense signal processing.

Quality & Compliance

Active production status with full manufacturer traceability. RoHS and REACH compliant. Long lifecycle support guaranteed by Altera/Intel for mission-critical deployments.

Product attributes Property Value
Manufacturer Altera
Product Series Agilex F
Packaging Tray |
Part Status Active
Architecture MPU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 1.4GHz
Primary Attributes FPGA - 2.3M Logic Elements
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 3184-BFBGA Exposed Pad
Supplier Device Package 3184-BGA (56x45)

No datasheet available. Please contact sales@hqickey.com for the latest datasheet.