Texas Instruments DRA829JMTGBALFR

Zu Produktinformationen springen
1 von 1
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Normaler Preis Dhs. 424.16
Normaler Preis Dhs. 446.49 Verkaufspreis Dhs. 424.16
Sale Ausverkauft
Quantity Unit Price Total Price
1 Dhs. 424.16 Dhs. 424.16
15+ Dhs. 410.77 Dhs. 6,161.55
25+ Dhs. 401.84 Dhs. 10,046.00
50+ Dhs. 379.52 Dhs. 18,976.00
100+ Dhs. 334.87 Dhs. 33,487.00
N+ Dhs. 66.97 Price Inquiry
Versand wird beim Checkout berechnet
Anzahl
Component Recycling

Request Quote / Inquiry

Texas Instruments DRA829JMTGBALFR - High-Performance Heterogeneous SoC

The DRA829JMTGBALFR is a powerful system-on-chip (SoC) from Texas Instruments featuring a heterogeneous multi-core architecture designed for demanding automotive, industrial, and embedded vision applications. This device combines dual ARM Cortex-A72 application processors, quad ARM Cortex-R5F real-time processors, C66x DSP, and C7x deep learning accelerator cores to deliver exceptional processing performance and flexibility.

Key Features

  • Multi-Core Architecture: Dual ARM Cortex-A72 (2GHz), Quad ARM Cortex-R5F (1GHz), C66x DSP (1.35GHz), C7x (1GHz)
  • Memory: 1.5MB integrated RAM for high-speed data processing
  • Connectivity: Comprehensive peripheral support including I2C, I3C, MCAN, MMC/SD/SDIO, SPI, UART, and USB
  • Peripherals: DMA, PWM, and WDT for flexible system integration
  • Operating Temperature: Automotive-grade -40°C to 105°C (TJ) for harsh environments
  • Package: 827-FCBGA (24x24mm) for compact, high-density designs

Applications

Ideal for advanced driver assistance systems (ADAS), industrial automation, robotics, machine vision, gateway applications, and AI/ML edge computing requiring heterogeneous processing capabilities.

Availability

This product is currently in Last Time Buy status. Available in Cut Tape (CT) and Tape & Reel (TR) packaging options.

Product attributes Property Value
Manufacturer Texas Instruments
Product Series
Packaging Cut Tape (CT) | Tape & Reel (TR)
Part Status Last Time Buy
Architecture DSP, MCU, MPU
Core Processor ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
Flash Size -
RAM Size 1.5MB
Peripherals DMA, PWM, WDT
Connectivity I2C, I3C, MCAN, MMC/SD/SDIO, SPI, UART, USB
Speed 2GHz, 1GHz, 1.35GHz, 1GHz
Primary Attributes -
Operating Temperature -40°C ~ 105°C (TJ)
Grade -
Qualification -
Package / Case 827-BFBGA, FCBGA
Supplier Device Package 827-FCBGA (24x24)