Texas Instruments DRA829VMTGBALFRQ1
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 344.86 | Dhs. 344.86 |
| 15+ | Dhs. 333.95 | Dhs. 5,009.25 |
| 25+ | Dhs. 326.69 | Dhs. 8,167.25 |
| 50+ | Dhs. 308.54 | Dhs. 15,427.00 |
| 100+ | Dhs. 272.24 | Dhs. 27,224.00 |
| N+ | Dhs. 54.45 | Price Inquiry |
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Texas Instruments DRA829VMTGBALFRQ1 Automotive System-on-Chip
The DRA829VMTGBALFRQ1 is a high-performance automotive-grade System-on-Chip (SoC) from Texas Instruments, engineered for advanced driver assistance systems (ADAS), gateway applications, and mission-critical automotive computing. This heterogeneous multi-core processor combines ARM Cortex-A72 application processors, Cortex-R5F real-time cores, C66x DSP, and C7x deep learning accelerators to deliver exceptional processing power and functional safety for next-generation vehicles.
Key Features
- Heterogeneous Multi-Core Architecture: Dual ARM Cortex-A72 cores (2GHz), quad ARM Cortex-R5F cores (1GHz), C66x DSP (1.35GHz), and C7x deep learning core (1GHz) for parallel processing
- Automotive-Grade Reliability: Operating temperature range -40°C to 125°C (TJ) for harsh automotive environments and mission-critical applications
- Rich Connectivity: I2C, I3C, MCAN, MMC/SD/SDIO, SPI, UART, and USB interfaces for comprehensive system integration
- Advanced Peripherals: DMA, PWM, and WDT for comprehensive system control and real-time processing
- Compact Package: 827-FCBGA (24x24mm) for space-constrained automotive designs
- 1.5MB On-Chip RAM: High-speed memory for real-time processing and low-latency operations
- Deep Learning Acceleration: C7x core optimized for AI/ML workloads in ADAS applications
Applications
Ideal for automotive applications including ADAS sensor fusion, autonomous driving compute platforms, vehicle gateway controllers, digital cockpit systems, safety-critical real-time processing, camera and radar processing, and V2X communication systems.
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| Product attributes | Property Value |
| Manufacturer | Texas Instruments |
| Product Series | |
| Packaging | Tape & Reel (TR) | Tape & Reel (TR) |
| Architecture | DSP, MCU, MPU |
| Core Processor | ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x |
| Flash Size | - |
| RAM Size | 1.5MB |
| Peripherals | DMA, PWM, WDT |
| Connectivity | I2C, I3C, MCAN, MMC/SD/SDIO, SPI, UART, USB |
| Speed | 2GHz, 1GHz, 1.35GHz, 1GHz |
| Primary Attributes | - |
| Operating Temperature | -40°C ~ 125°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 827-BFBGA, FCBGA |
| Supplier Device Package | 827-FCBGA (24x24) |

DRA829VMTGBALFRQ1.pdf