Zu Produktinformationen springen
1 von 1
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Normaler Preis $4.57
Normaler Preis $4.81 Verkaufspreis $4.57
Sale Ausverkauft
Quantity Unit Price Total Price
1 $4.57 $4.57
15+ $4.43 $66.45
25+ $4.33 $108.25
50+ $4.09 $204.50
100+ $3.61 $361.00
N+ $0.72 Price Inquiry
Versand wird beim Checkout berechnet
Anzahl
Component Recycling

Request Quote / Inquiry

Product attributes Property Value
Manufacturer Lattice Semiconductor Corporation
Product Series iCE40 Ultra™
Packaging Tape & Reel (TR) | Tape & Reel (TR)
Number of LABs/CLBs 138
Number of Logic Elements/Cells 1100
Total RAM Bits 65536
Number of I/O 26
Number of Gates -
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 36-VFBGA
Supplier Device Package 36-UCFBGA (2.5x2.5)

Lattice ICE5LP1K-CM36ITR1K - iCE40 Ultra™ FPGA

The ICE5LP1K-CM36ITR1K is an ultra-low-power FPGA from Lattice Semiconductor's iCE40 Ultra™ family, engineered for space-constrained, power-sensitive applications in mobile, IoT, wearables, and edge computing. With 1100 logic elements, 65Kb embedded RAM, and 26 general-purpose I/O in a compact 36-pin UCFBGA (2.5×2.5mm) package, this device delivers programmable logic performance with minimal footprint and energy consumption.

Key Features

  • 1100 Logic Elements (LUTs) across 138 LABs/CLBs for flexible HDL design
  • 65,536 bits of embedded SRAM for buffering and state machines
  • 26 configurable I/O pins supporting multiple voltage standards
  • Ultra-low power: 1.14V–1.26V core supply, optimized for battery-powered designs
  • Industrial temperature range: -40°C to +100°C (TJ) for automotive, industrial, and outdoor deployments
  • Surface-mount 36-UCFBGA package (2.5×2.5mm) for high-density PCB layouts
  • Tape & reel packaging for automated assembly and volume production

Applications

Ideal for sensor hubs, always-on co-processors, mobile vision preprocessing, I/O expansion, protocol bridging, and real-time control in resource-constrained embedded systems.

Full Electrical and Mechanical Specifications

All specifications subject to manufacturer's datasheet. RoHS compliant. Consult factory documentation for complete electrical characteristics, timing diagrams, and programming guidelines.