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Normaler Preis Dhs. 10.30
Normaler Preis Dhs. 10.83 Verkaufspreis Dhs. 10.30
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1 Dhs. 10.30 Dhs. 10.30
15+ Dhs. 9.96 Dhs. 149.40
25+ Dhs. 9.75 Dhs. 243.75
50+ Dhs. 9.21 Dhs. 460.50
100+ Dhs. 8.12 Dhs. 812.00
N+ Dhs. 1.62 Price Inquiry
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Product attributes Property Value
Manufacturer ISSI, Integrated Silicon Solution Inc
Product Series
Packaging Tape & Reel (TR) |
Memory Type Volatile
Memory Format DRAM
Technology SDRAM
Memory Size 128Mbit
Memory Organization 4M x 32
Memory Interface LVTTL
Clock Frequency 166 MHz
Write Cycle Time - Word, Page -
Access Time 5.4 ns
Voltage - Supply 3V ~ 3.6V
Operating Temperature 0°C ~ 70°C (TA)
Grade -
Qualification -
Mounting Type Surface Mount
Package / Case 86-TFSOP (0.400", 10.16mm Width)
Supplier Device Package 86-TSOP II

IS42S32400J-6TL-TR - High-Performance 128Mbit SDRAM Memory IC

The IS42S32400J-6TL-TR from ISSI (Integrated Silicon Solution Inc) is a high-reliability 128Mbit synchronous DRAM designed for demanding embedded applications in aerospace, automotive, industrial control, telecommunications, and medical equipment. This volatile memory solution delivers exceptional performance with a 166MHz clock frequency and ultra-fast 5.4ns access time.

Key Features & Benefits:

  • High-Speed Performance: 166MHz clock frequency with 5.4ns access time ensures rapid data processing for time-critical applications
  • Flexible Memory Organization: 4M x 32 configuration optimized for 32-bit microcontroller and processor architectures
  • LVTTL Interface: Low-voltage TTL compatibility (3V ~ 3.6V) reduces power consumption while maintaining signal integrity
  • Industrial Temperature Range: Operates reliably from 0°C to 70°C for harsh environmental conditions
  • Surface Mount Package: 86-TSOP II package (86-TFSOP) enables compact PCB layouts and automated assembly
  • Tape & Reel Packaging: Production-ready format for high-volume manufacturing

Typical Applications:

This SDRAM memory IC is ideal for embedded systems requiring fast, reliable volatile memory including industrial controllers, automotive ECUs, telecommunications infrastructure, medical diagnostic equipment, aerospace avionics, and high-performance computing modules.


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