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Normaler Preis Dhs. 15.25
Normaler Preis Dhs. 16.03 Verkaufspreis Dhs. 15.25
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Quantity Unit Price Total Price
1 Dhs. 15.25 Dhs. 15.25
15+ Dhs. 14.75 Dhs. 221.25
25+ Dhs. 14.43 Dhs. 360.75
50+ Dhs. 13.63 Dhs. 681.50
100+ Dhs. 12.02 Dhs. 1,202.00
N+ Dhs. 2.40 Price Inquiry
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Product attributes Property Value
Manufacturer ISSI, Integrated Silicon Solution Inc
Product Series
Packaging Bulk |
Memory Type Volatile
Memory Format DRAM
Technology SDRAM - DDR3L
Memory Size 2Gbit
Memory Organization 256M x 8
Memory Interface Parallel
Clock Frequency 933 MHz
Write Cycle Time - Word, Page 15ns
Access Time 20 ns
Voltage - Supply 1.283V ~ 1.45V
Operating Temperature 0°C ~ 95°C (TC)
Grade -
Qualification -
Mounting Type Surface Mount
Package / Case 78-TFBGA
Supplier Device Package 78-TWBGA (8x10.5)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

IS43TR82560DL-107MBL - DDR3L SDRAM Memory IC

The IS43TR82560DL-107MBL from ISSI (Integrated Silicon Solution Inc) is a high-performance 2Gbit DDR3L SDRAM memory IC designed for industrial and embedded applications requiring reliable, low-power memory solutions. With a 256M x 8 organization and 933MHz clock frequency, this component delivers robust performance across demanding operating conditions (0°C to 95°C).

Key Features:

  • 2Gbit DDR3L SDRAM technology with low voltage operation (1.283V ~ 1.45V)
  • 256M x 8 memory organization with parallel interface
  • 933MHz clock frequency for high-speed data access
  • 78-TFBGA surface mount package (8x10.5mm)
  • Industrial temperature range: 0°C ~ 95°C (TC)
  • RoHS and REACH compliant for environmental standards
  • 15ns write cycle time, 20ns access time

Applications: Ideal for aerospace, automotive, industrial control systems, medical devices, telecommunications infrastructure, and other high-reliability applications requiring long lifecycle support and full component traceability.

As an authorized distributor, we provide 100% traceable components with original manufacturer documentation, compliance certifications, and long-term availability commitments.