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Normaler Preis Dhs. 10.41
Normaler Preis Dhs. 10.98 Verkaufspreis Dhs. 10.41
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1 Dhs. 10.41 Dhs. 10.41
15+ Dhs. 10.10 Dhs. 151.50
25+ Dhs. 9.88 Dhs. 247.00
50+ Dhs. 9.33 Dhs. 466.50
100+ Dhs. 8.24 Dhs. 824.00
N+ Dhs. 1.65 Price Inquiry
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Product attributes Property Value
Manufacturer ISSI, Integrated Silicon Solution Inc
Product Series
Packaging Tray |
Memory Type Volatile
Memory Format DRAM
Technology SDRAM
Memory Size 16Mbit
Memory Organization 1M x 16
Memory Interface Parallel
Clock Frequency 143 MHz
Write Cycle Time - Word, Page -
Access Time 5.5 ns
Voltage - Supply 3V ~ 3.6V
Operating Temperature -40°C ~ 105°C (TA)
Grade -
Qualification -
Mounting Type Surface Mount
Package / Case 60-TFBGA
Supplier Device Package 60-TFBGA (6.4x10.1)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

The IS45S16100H-7BLA2 is a high-performance 16Mbit SDRAM memory IC manufactured by ISSI (Integrated Silicon Solution Inc), designed for demanding applications in aerospace, automotive, industrial, medical, and telecommunications sectors. This volatile DRAM chip features a 1M x 16 memory organization with parallel interface, operating at 143 MHz clock frequency and 5.5 ns access time.

Engineered for reliability in extreme conditions, this surface-mount SDRAM operates across an extended temperature range of -40°C to 105°C, making it ideal for mission-critical embedded systems. The compact 60-TFBGA (6.4x10.1) package provides space-efficient integration while maintaining robust performance with a 3V to 3.6V supply voltage range.

Key Features & Benefits:

  • 16Mbit capacity with 1M x 16 organization for flexible data management
  • High-speed 143 MHz operation with 5.5 ns access time
  • Extended temperature range (-40°C to 105°C) for harsh environments
  • Low voltage operation (3V-3.6V) for power-efficient designs
  • Compact 60-TFBGA surface mount package
  • RoHS compliant for environmental standards

Applications: Embedded controllers, automotive electronics, industrial automation, medical devices, telecommunications equipment, and aerospace systems requiring reliable high-speed memory solutions.

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