NXP USA Inc. KMPC8270VVUPEA

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Normaler Preis Dhs. 379.87
Normaler Preis Dhs. 399.87 Verkaufspreis Dhs. 379.87
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1 Dhs. 379.87 Dhs. 379.87
15+ Dhs. 367.88 Dhs. 5,518.20
25+ Dhs. 359.88 Dhs. 8,997.00
50+ Dhs. 339.89 Dhs. 16,994.50
100+ Dhs. 299.90 Dhs. 29,990.00
N+ Dhs. 59.98 Price Inquiry
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Product Overview

The KMPC8270VVUPEA is a high-performance PowerPC G2_LE microprocessor from NXP USA Inc., engineered for demanding embedded applications in aerospace, automotive, industrial control, telecommunications, and medical equipment. Operating at 450MHz with a 32-bit architecture, this processor delivers robust computing power combined with advanced communication capabilities.

Key Features & Benefits

  • High-Performance Processing: PowerPC G2_LE core running at 450MHz ensures efficient execution of complex embedded applications
  • Advanced Communication: Integrated Communications Processor Module (CPM) with RISC architecture for protocol offloading
  • Triple Ethernet Connectivity: Three 10/100Mbps Ethernet ports enable robust networking and redundancy
  • Flexible Memory Support: Built-in DRAM and SDRAM controllers for versatile memory configurations
  • Rich Peripheral Set: USB 2.0, I2C, SPI, UART, USART, SCC, and SMC interfaces for comprehensive system integration
  • Extended Temperature Range: Operates reliably from 0°C to 105°C, ideal for industrial and automotive environments
  • Compact Surface Mount Package: 480-TBGA (37.5x37.5mm) with exposed pad for enhanced thermal performance
  • RoHS Compliant: Meets environmental standards for lead-free manufacturing

This microprocessor features a single-core 32-bit PowerPC G2_LE architecture with integrated communications and RISC CPM co-processors. The device supports 3.3V I/O voltage and includes comprehensive interface options including I2C, SCC, SMC, SPI, UART, and USART. The 480-LBGA exposed pad package (480-TBGA supplier designation) provides excellent thermal dissipation characteristics essential for high-reliability applications.

Applications

The KMPC8270VVUPEA is ideally suited for network routers, industrial automation controllers, telecommunications infrastructure, automotive gateway modules, medical imaging systems, and aerospace avionics where reliable high-performance processing with extensive communication capabilities is required.

Related Resources

Explore our complete range of Microprocessors for additional PowerPC, ARM, and x86 solutions. Visit our homepage to discover our full catalog of high-reliability semiconductors. For technical insights, application notes, and industry trends, check out our technical blog.

Product attributes Property Value
Manufacturer NXP USA Inc.
Product Series
Packaging Box |
Core Processor PowerPC G2_LE
Number of Cores/Bus Width 1 Core, 32-Bit
Speed 450MHz
Co-Processors/DSP Communications; RISC CPM
RAM Controllers DRAM, SDRAM
Graphics Acceleration No
Display & Interface Controllers -
Ethernet 10/100Mbps (3)
SATA -
USB USB 2.0 (1)
Voltage - I/O 3.3V
Operating Temperature 0°C ~ 105°C (TA)
Grade -
Qualification -
Security Features -
Mounting Type Surface Mount
Package / Case 480-LBGA Exposed Pad
Supplier Device Package 480-TBGA (37.5x37.5)
Additional Interfaces I2C, SCC, SMC, SPI, UART, USART
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY