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Lattice LFE3-70E-6FN1156I - High-Performance ECP3 FPGA

The LFE3-70E-6FN1156I from Lattice Semiconductor is a high-density FPGA from the ECP3 family, engineered for demanding applications in aerospace, automotive, industrial control, medical devices, and telecommunications. This industrial-grade FPGA delivers exceptional performance with 67,000 logic elements and 490 I/O pins in a compact 1156-FBGA surface mount package.

Key Features & Benefits

  • High Logic Density: 67,000 logic elements across 8,375 LABs/CLBs for complex digital designs
  • Extensive Memory: 4.5 Mb (4,526,080 bits) of embedded RAM for data buffering and processing
  • Flexible I/O: 490 configurable I/O pins supporting multiple interface standards
  • Industrial Temperature Range: Operates reliably from -40°C to 100°C (TJ) for harsh environments
  • Low Power Operation: 1.14V to 1.26V supply voltage for energy-efficient designs
  • Compact Footprint: 35mm × 35mm 1156-pin FPBGA package optimized for space-constrained applications

Applications

Ideal for high-reliability systems requiring full traceability and long lifecycle support including industrial automation controllers, medical imaging equipment, aerospace avionics, automotive ADAS systems, and telecom infrastructure.

Design Support

Complete technical documentation, reference designs, and datasheets available. Our engineering team provides design-in support to accelerate your development cycle.

Compliance & Quality

RoHS/REACH compliant. Full traceability documentation available. Authorized distributor with factory-sealed packaging and quality certifications.

Product attributes Property Value
Manufacturer Lattice Semiconductor Corporation
Product Series ECP3
Packaging | Tray
Number of LABs/CLBs 8375
Number of Logic Elements/Cells 67000
Total RAM Bits 4526080
Number of I/O 490
Number of Gates -
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 1156-BBGA
Supplier Device Package 1156-FPBGA (35x35)