Lattice Semiconductor Corporation LFE3-70E-8FN672I
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 355,887.50 | Dhs. 355,887.50 |
| 15+ | Dhs. 344,648.95 | Dhs. 5,169,734.25 |
| 25+ | Dhs. 337,156.58 | Dhs. 8,428,914.50 |
| 50+ | Dhs. 318,425.66 | Dhs. 15,921,283.00 |
| 100+ | Dhs. 280,963.82 | Dhs. 28,096,382.00 |
| N+ | Dhs. 56,192.76 | Price Inquiry |
Request Quote / Inquiry
| Product attributes | Property Value |
| Manufacturer | Lattice Semiconductor Corporation |
| Product Series | ECP3 |
| Packaging | | Tray |
| Number of LABs/CLBs | 8375 |
| Number of Logic Elements/Cells | 67000 |
| Total RAM Bits | 4526080 |
| Number of I/O | 380 |
| Number of Gates | - |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 672-BBGA |
| Supplier Device Package | 672-FPBGA (27x27) |
Lattice LFE3-70E-8FN672I FPGA - High-Performance ECP3 Series
The LFE3-70E-8FN672I is a high-density FPGA from Lattice Semiconductor's ECP3 family, engineered for demanding applications in aerospace, automotive, industrial control, medical devices, and telecommunications. With 67,000 logic elements and 380 I/O pins, this device delivers exceptional performance and flexibility for complex digital designs.
Key Features & Benefits
- 67,000 Logic Elements - Ample resources for sophisticated digital logic implementations
- 380 I/O Pins - Extensive connectivity for high-bandwidth interfaces
- 4.5 Megabits Embedded RAM - On-chip memory for buffering and data processing
- Industrial Temperature Range - Reliable operation from -40°C to 100°C (TJ)
- Low Power Consumption - 1.14V to 1.26V supply voltage for energy-efficient designs
- 672-FPBGA Package - Compact 27mm x 27mm footprint for space-constrained applications
Applications
Ideal for high-reliability systems requiring programmable logic with extensive I/O capabilities, including industrial automation controllers, medical imaging equipment, aerospace avionics, automotive ADAS systems, and telecom infrastructure.
Quality & Compliance
Supplied with full traceability documentation, RoHS/REACH compliant. Surface mount technology for automated assembly. Tray packaging for production-scale procurement.
Need design support? Contact our engineering team for datasheets, reference designs, and technical guidance.
LFE3-70E-8FN672I.pdf