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Normaler Preis Dhs. 355,887.50
Normaler Preis Dhs. 374,618.42 Verkaufspreis Dhs. 355,887.50
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Product attributes Property Value
Manufacturer Lattice Semiconductor Corporation
Product Series ECP3
Packaging | Tray
Number of LABs/CLBs 11500
Number of Logic Elements/Cells 92000
Total RAM Bits 4526080
Number of I/O 490
Number of Gates -
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Grade -
Qualification -
Package / Case 1156-BBGA
Supplier Device Package 1156-FPBGA (35x35)

Lattice LFE3-95E-6FN1156C - High-Performance ECP3 FPGA

The LFE3-95E-6FN1156C is a high-density FPGA from Lattice Semiconductor's ECP3 family, engineered for demanding applications in aerospace, industrial automation, medical devices, and telecommunications. With 92,000 logic elements and 490 I/O pins, this device delivers exceptional performance for complex digital designs requiring extensive parallel processing and connectivity.

Key Features & Benefits

  • High Logic Density: 92,000 logic elements across 11,500 LABs/CLBs for complex algorithm implementation
  • Extensive Memory: 4.5Mb embedded RAM for buffering and data-intensive operations
  • Rich I/O Capability: 490 configurable I/O pins supporting multiple interface standards
  • Industrial Temperature Range: 0°C to 85°C (TJ) operation for reliable performance in harsh environments
  • Compact High-Density Package: 1156-FBGA (35x35mm) for space-constrained designs
  • Low Power Operation: 1.14V ~ 1.26V supply voltage for energy-efficient designs

Applications

Ideal for high-speed data processing, protocol bridging, motor control, video processing, communications infrastructure, and embedded vision systems.

Quality & Compliance

As an authorized distributor, we provide 100% authentic Lattice components with full traceability, RoHS/REACH compliance documentation, and manufacturer datasheets. All units ship in factory-sealed tray packaging with anti-static protection.

Design Support: Reference designs, application notes, and technical documentation available. Contact our engineering team for design-in assistance.