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Lattice LFECP10E-3FN256C Field Programmable Gate Array

The LFECP10E-3FN256C from Lattice Semiconductor Corporation is a high-performance FPGA from the ECP series, designed for demanding applications in aerospace, automotive, industrial control, telecommunications, and medical systems. With 10,200 logic elements and 282,624 RAM bits, this FPGA delivers exceptional processing power and flexibility for complex digital designs.

Key Features & Benefits

  • 10,200 Logic Elements - Ample resources for sophisticated digital logic implementation
  • 282,624 Total RAM Bits - Extensive on-chip memory for data buffering and processing
  • 195 I/O Pins - High pin count enables complex system interfacing
  • 1.14V to 1.26V Supply Voltage - Low-power operation for energy-efficient designs
  • Surface Mount 256-FPBGA Package - Compact 17x17mm footprint ideal for space-constrained applications
  • Industrial Temperature Range - Reliable operation from 0°C to 85°C (TJ)
  • Tray Packaging - Ready for automated assembly processes

Applications

This FPGA is ideal for mission-critical systems requiring high reliability and performance, including industrial automation controllers, medical imaging equipment, telecommunications infrastructure, automotive safety systems, and aerospace avionics. The ECP series architecture provides an optimal balance of logic density, memory, and I/O capability.

Why Choose HQICKEY

As an authorized distributor of Lattice Semiconductor products, HQICKEY guarantees 100% authentic components with full traceability and manufacturer warranty support. Our technical team provides application support and design resources to accelerate your development cycle.

Related Resources

Explore our complete range of FPGAs Field Programmable Gate Array ICs for your embedded system designs. Visit HQICKEY to browse our full catalog of high-reliability semiconductors. Stay updated with the latest industry insights and product announcements on our News & Technical Blog.

Product attributes Property Value
Manufacturer Lattice Semiconductor Corporation
Product Series ECP
Packaging | Tray
Number of LABs/CLBs -
Number of Logic Elements/Cells 10200
Total RAM Bits 282624
Number of I/O 195
Number of Gates -
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Grade -
Qualification -
Package / Case 256-BGA
Supplier Device Package 256-FPBGA (17x17)