Lattice Semiconductor Corporation LFSCM3GA115EP1-6FCN1152I

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Normaler Preis $94,999.99
Normaler Preis $99,999.99 Verkaufspreis $94,999.99
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1 $94,999.99 $94,999.99
15+ $91,999.99 $1,379,999.85
25+ $89,999.99 $2,249,999.75
50+ $84,999.99 $4,249,999.50
100+ $74,999.99 $7,499,999.00
N+ $15,000.00 Price Inquiry
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Product attributes Property Value
Manufacturer Lattice Semiconductor Corporation
Product Series SCM
Packaging | Tray
Number of LABs/CLBs 28750
Number of Logic Elements/Cells 115000
Total RAM Bits 7987200
Number of I/O 660
Number of Gates -
Voltage - Supply 0.95V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 105°C (TJ)
Grade -
Qualification -
Package / Case 1152-BBGA, FCBGA
Supplier Device Package 1152-FCBGA (35x35)

Lattice LFSCM3GA115EP1-6FCN1152I - High-Density FPGA Solution

The LFSCM3GA115EP1-6FCN1152I from Lattice Semiconductor Corporation is a high-performance FPGA from the SCM series, designed for demanding applications requiring substantial logic resources and I/O flexibility. With 115,000 logic elements and 660 I/O pins, this device delivers exceptional processing capability for industrial, automotive, aerospace, and telecommunications applications.

Key Features

  • 115,000 Logic Elements - Extensive programmable logic for complex designs
  • 7.99 Mb Total RAM - Ample on-chip memory for data buffering and processing
  • 660 I/O Pins - Maximum connectivity and interface flexibility
  • Industrial Temperature Range - Reliable operation from -40°C to 105°C (TJ)
  • 1152-FCBGA Package - Compact 35x35mm footprint for space-constrained designs
  • Low Voltage Operation - 0.95V to 1.26V supply voltage for power efficiency

Applications

Ideal for high-reliability applications including aerospace systems, automotive electronics, industrial automation, medical devices, and telecommunications infrastructure where long lifecycle support and full component traceability are essential.

Quality & Compliance

Supplied with full manufacturer traceability, RoHS/REACH compliance documentation, and long lifecycle commitment. Surface mount package suitable for automated assembly processes.