Lattice Semiconductor Corporation LFSCM3GA80EP1-6FCN1152C

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Lattice Semiconductor LFSCM3GA80EP1-6FCN1152C FPGA

High-performance System-on-Chip FPGA from Lattice Semiconductor's SCM family, engineered for demanding industrial, automotive, aerospace, communications, and edge computing applications. This device delivers exceptional logic density with 80,000 logic elements and 660 I/O pins in a compact 1152-FCBGA surface mount package.

Key Features & Benefits

  • Massive Logic Capacity: 80,000 logic elements across 20,000 LABs/CLBs for complex FPGA fabric-intensive designs
  • High-Speed I/O: 660 I/O pins enable extensive connectivity for multi-interface systems
  • Generous Memory: 5,816,320 total RAM bits for data buffering and processing
  • Industrial Temperature Range: Reliable operation from 0°C to 85°C (TJ) for harsh environments
  • Flexible Power Supply: 0.95V to 1.26V supply voltage range for power optimization
  • Compact Form Factor: 1152-FCBGA (35x35mm) surface mount package for space-constrained designs

Ideal Applications

Perfect for FPGA SoC implementations in industrial automation, automotive ADAS systems, aerospace avionics, telecommunications infrastructure, and edge AI/ML acceleration where high logic density, extensive I/O, and reliable performance are critical.

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Product attributes Property Value
Manufacturer Lattice Semiconductor Corporation
Product Series SCM
Packaging Marketplace | Tray
Number of LABs/CLBs 20000
Number of Logic Elements/Cells 80000
Total RAM Bits 5816320
Number of I/O 660
Number of Gates -
Voltage - Supply 0.95V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Grade -
Qualification -
Package / Case 1152-BBGA, FCBGA
Supplier Device Package 1152-FCBGA (35x35)