NXP USA Inc. LPC2138FHN64/01,55

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Normaler Preis Dhs. 355,870.06
Normaler Preis Dhs. 374,600.06 Verkaufspreis Dhs. 355,870.06
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1 Dhs. 355,870.06 Dhs. 355,870.06
15+ Dhs. 344,632.06 Dhs. 5,169,480.90
25+ Dhs. 337,140.05 Dhs. 8,428,501.25
50+ Dhs. 318,410.05 Dhs. 15,920,502.50
100+ Dhs. 280,950.05 Dhs. 28,095,005.00
N+ Dhs. 56,190.01 Price Inquiry
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The LPC2138FHN64/01,55 is a high-performance 16/32-bit ARM7® microcontroller from NXP USA Inc., designed for demanding embedded and industrial applications. This powerful MCU combines a 60MHz processing speed with 512KB Flash memory and 32KB RAM, making it ideal for complex control systems, data acquisition, and communication-intensive projects.

Key Features & Benefits:

  • High-Performance ARM7® Core: 16/32-bit architecture running at 60MHz delivers exceptional processing power for real-time applications
  • Generous Memory: 512KB Flash program memory and 32KB RAM provide ample space for sophisticated firmware and data handling
  • Rich Connectivity: Multiple communication interfaces including I2C, SPI, SSP, UART/USART, and Microwire enable seamless integration with various peripherals
  • Extensive I/O Capability: 47 general-purpose I/O pins offer maximum flexibility for interfacing with sensors, actuators, and displays
  • Advanced Peripherals: Built-in PWM, WDT, Brown-out Detect/Reset, and POR enhance system reliability and control precision
  • Precision Data Conversion: 16-channel 10-bit SAR ADC and 1-channel 10-bit DAC support accurate analog signal processing
  • Industrial-Grade Reliability: Operating temperature range of -40°C to 85°C ensures stable performance in harsh environments
  • Compact Surface Mount Package: 64-HVQFN (9x9mm) with exposed pad optimizes board space and thermal performance

Technical Specifications:

Applications:

  • Industrial automation and control systems
  • Motor control and robotics
  • Data acquisition and instrumentation
  • Communication gateways and protocol converters
  • Automotive electronics
  • Medical devices and equipment
  • Building automation systems

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Product attributes Property Value
Manufacturer NXP USA Inc.
Product Series LPC2100
Packaging | Tray
Core Processor ARM7®
Core Size 16/32-Bit
Speed 60MHz
Connectivity I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O 47
Program Memory Size 512KB (512K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 32K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 3.6V
Data Converters A/D 16x10b SAR; D/A 1x10b
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Grade -
Qualification -
Mounting Type Surface Mount
Supplier Device Package 64-HVQFN (9x9)
Package / Case 64-VFQFN Exposed Pad